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A method for manufacturing a fine metal mask using electroplating

A fine metal mask, metal technology, applied in the direction of metal material coating process, electroforming, electrolysis process, etc., can solve the problems of difficult to form precise patterns, difficult to control the slope of the wall profile of the pattern, etc., to shorten the manufacturing time, Prevents welding defects and warping or sagging, increasing speed

Inactive Publication Date: 2018-01-05
AP SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has a problem that it is difficult to form an accurate pattern due to the characteristics of dry film resist (DFR) compared to the method using liquid photoresist
However, it is difficult to control the slope of the wall profile of the pattern using conventional methods

Method used

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  • A method for manufacturing a fine metal mask using electroplating
  • A method for manufacturing a fine metal mask using electroplating
  • A method for manufacturing a fine metal mask using electroplating

Examples

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Embodiment Construction

[0036] Example embodiments are described more fully herein hereinafter with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the example embodiments set forth herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0037] figure 2 is a flowchart illustrating a method for fabricating a fine metal mask using an electroplating process according to an embodiment of the present invention, and image 3 A to image 3 I is a sectional view sequentially showing various stages in the manufacturing method according to the embodiment of the present invention.

[0038] The fine metal mask manufacturing method according to an embodiment of the present invention is a method of obtaining the metal mask 70 by using the glass substrate 10 as a carrier to prevent ...

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Abstract

Disclosed is a method for manufacturing a fine metal mask using electroplating. The method includes the following steps: (a), forming a sacrificial layer on a carrier; (b) forming an electrode layer on the sacrificial layer; (c) forming a photoresist coating on the electrode layer; (d) patterning the photoresist coating through photoetching; (e) forming an electroplating layer; (f) removing the patterned photoresist coating to make the electroplating layer serving as a metal pattern remain; (g) patterning the electrode layer and forming a pattern corresponding to the metal pattern, thereby forming a mask pattern including the electroplating layer and the electrode layer; (h) performing heat treatment to increase the hardness of the mask pattern; (i) checking the mask pattern; and (j) separating the mask pattern from the carrier.

Description

technical field [0001] The present invention generally relates to methods of fabricating fine metal masks using electroplating processes. More specifically, the present invention relates to a method of manufacturing a fine metal mask using an electroplating process, which can significantly reduce warping or sagging of a large-area metal mask, resulting in a pattern having a pitch of A fine metal mask with a fine pattern of 40μm improves product reliability and significantly reduces manufacturing time. Background technique [0002] Traditionally, metal masks have been fabricated by laser processing or metal etching. Laser processing is a method of forming desired openings required for solder screen printing in the surface of a SUS substrate having a thickness from 100 to 200 μm by using a laser processing device. However, this method has limitations in reducing the size of the pattern of the metal mask. That is, this method cannot be applied to a metal mask having a patter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/22
CPCC25D1/10C25D5/022C25D5/024
Inventor 金治宇朴钟甲申兴铉
Owner AP SYST INC
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