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High-temperature co-fired ceramic thick-film conductor paste

A high-temperature co-fired ceramic and conductor paste technology, applied in metal/alloy conductors, conductive materials dispersed in non-conductive inorganic materials, etc., to achieve the effect of less binder, improved plasticity, and dense metallization layer

Inactive Publication Date: 2017-12-12
郑州联冠科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-temperature co-firing technology of alumina substrate and conductive paste is very important. Since the sintering temperature of 96% alumina is 1400~1650°C, traditional metal thick film conductive materials such as silver, gold, platinum and other precious metals have emerged in recent years. Copper and other base metals are not suitable as co-fired conductor materials, only refractory tungsten and molybdenum can be used as conductive materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A high-temperature co-fired ceramic thick-film conductor paste, including powder and suspension, the weight percentage of the powder and suspension is: 80% powder; 20% suspension, the powder includes tungsten powder and Inorganic binder, the weight percentage of tungsten powder and inorganic binder is: tungsten powder 96%; inorganic binder 4%, the inorganic binder is alumina powder, and the tungsten powder in the powder is spherical tungsten powder , its particle diameter is 0.2~2 micron, and described suspension comprises terpineol, ethyl cellulose and dibutyl phthalate, and each component weight percent is: terpineol 92%; Ethyl cellulose 6%; dibutyl phthalate 2%.

[0021] The preparation process for preparing the above-mentioned high-temperature co-fired ceramic thick-film conductor slurry includes the following process steps:

[0022] a. Weigh tungsten powder and alumina powder by weight percentage,

[0023] b. Weigh terpineol, ethyl cellulose and dibutyl phthalate...

Embodiment 2

[0028] A high-temperature co-fired ceramic thick-film conductor paste, including powder and suspension, the weight percentage of the powder and suspension is: 90% powder; 10% suspension, the powder includes tungsten powder and Inorganic binder, the weight percentage of tungsten powder and inorganic binder is: tungsten powder 92%; inorganic binder 8%, the inorganic binder is alumina powder, and the tungsten powder in the powder is spherical tungsten powder , its particle diameter is 0.2~2 microns, and described suspension comprises terpineol, ethyl cellulose and dibutyl phthalate, and each component weight percent is: terpineol 96%; Ethyl cellulose 3.5%; dibutyl phthalate 0.5%.

[0029] The preparation process for preparing the above-mentioned high-temperature co-fired ceramic thick-film conductor slurry includes the following process steps:

[0030] a. Weigh tungsten powder and alumina powder by weight percentage,

[0031] b. Weigh terpineol, ethyl cellulose and dibutyl phth...

Embodiment 3

[0036] A high-temperature co-fired ceramic thick-film conductor paste, including powder and suspension, the weight percentage of the powder and suspension is: 85% powder; 15% suspension, the powder includes tungsten powder and Inorganic binder, the weight percentage of tungsten powder and inorganic binder is: tungsten powder 94%; inorganic binder 6%, the inorganic binder is alumina powder, and the tungsten powder in the powder is spherical tungsten powder , its particle diameter is 0.2~2 micron, and described suspension comprises terpineol, ethyl cellulose and dibutyl phthalate, and each component weight percent is: terpineol 94%; Ethyl cellulose 5%; dibutyl phthalate 1%.

[0037] The preparation process for preparing the above-mentioned high-temperature co-fired ceramic thick-film conductor slurry includes the following process steps:

[0038] a. Weigh tungsten powder and alumina powder by weight percentage,

[0039] b. Weigh terpineol, ethyl cellulose and dibutyl phthalate b...

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Abstract

The invention relates to a high-temperature co-fired ceramic thick-film conductor slurry, which includes powder and suspension. The weight percentages of powder and suspension are: powder 80-90%; suspension 10-20%, and the powder includes tungsten powder and inorganic binder, the weight percentage of each component is: tungsten powder 92~96%; inorganic binder 4~8%, the inorganic binder is alumina powder, and the suspension includes terpineol, ethyl cellulose And dibutyl phthalate, the weight percentage of each component is: 92-96% of terpineol; 3-7% of ethyl cellulose; 0.5-2% of dibutyl phthalate. The present invention simply uses alumina as the inorganic binder, and the main component of the alumina ceramic substrate is alumina, and simply uses alumina as the inorganic binder. During the sintering process, the inorganic binder and the alumina ceramic substrate and particles The chemical reaction occurs, which is conducive to the bonding and fixing of the conductor and the ceramic substrate, the matching is good, and the metallization layer is denser.

Description

technical field [0001] The invention relates to the technical field of high-temperature co-fired ceramic circuit board production, in particular to a high-temperature co-fired ceramic thick-film conductor slurry. Background technique [0002] Hybrid integrated circuits concentrate the functional parts of all components in a circuit on one substrate, which can basically eliminate the auxiliary parts in electronic components and the assembly gaps and solder joints between components, thus improving the assembly density and reliability of electronic equipment. It can be mainly used in communication equipment, high-voltage and high-current power switching circuits in the power industry, measurement control systems, aerospace radar and remote sensing systems, and civilian electronic products, among which thick-film conductors are thick-film hybrid integration It is one of the most widely used and earliest developed components in the circuit. [0003] The thick film conductor tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/02
CPCH01B1/22H01B1/02
Inventor 王维
Owner 郑州联冠科技有限公司
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