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Eutectic soldering process method of microwave chip

A technology of eutectic welding and microwave chips, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of not being suitable for the production of small batches, multi-variety modules, and high purchase costs

Inactive Publication Date: 2017-11-03
中科迪高微波系统有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, eutectic welding generally adopts manual eutectic method, eutectic furnace sintering method, and automatic eutectic placement machine method. Among them, eutectic furnace sintering method and automatic eutectic placement machine method are due to high equipment purchase costs and are suitable for large quantities. , not suitable for the production of small batches and multi-variety modules

Method used

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  • Eutectic soldering process method of microwave chip
  • Eutectic soldering process method of microwave chip
  • Eutectic soldering process method of microwave chip

Examples

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Embodiment 1

[0054]as attached figure 2 shown, with figure 2 It is a schematic diagram of microwave chip eutectic, carrier size specification: 4*8*0.2mm, preform size specification: 4*3.2*0.0254mm, chip size specification: 4*3.2*0.10mm; attached image 3 It is a schematic diagram of the microwave chip eutectic bonding process in Example 1. The specific implementation steps are as follows:

[0055] Step 1. Cleaning and drying of the carrier: put the carrier into an anhydrous ethanol solution, soak for 10 minutes, and then wipe the surface of the carrier (welding surface) with an absorbent cotton ball; then put the carrier into an oven at a temperature of 80-100°C , bake for 10 minutes;

[0056] Step 2. Plasma cleaning of the carrier: put the carrier in the previous step into a plasma cleaning machine for cleaning, and use argon gas for cleaning. The plasma cleaning power is: 500W, and the time: 15 minutes.

[0057] Step 3. Set the eutectic welding parameters:

[0058] The welding par...

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Abstract

The invention discloses a eutectic soldering process method of a microwave chip. The eutectic soldering process method comprises the steps of 1, cleaning and drying a carrier; 2, performing plasma cleaning on the carrier; 3, setting a eutectic soldering parameter; 4, placing and fixing the carrier; 5, placing a pre-formed gold-tin soldering lug; 6, placing the microwave chip; 7, adjusting a position of a quartz air duct; 8, performing eutectic soldering on the microwave chip; and 9, detecting soldering quality. The eutectic soldering process method of the microwave chip is simple to operate, is high in safety, has universality and is suitable for production of various types of products on a small scale.

Description

technical field [0001] The invention relates to microwave hybrid integrated circuit assembly, in particular to a process method for microwave chip eutectic welding. Background technique [0002] With the rapid development of the communication industry, multi-chip components are widely used in aerospace, military communication and other fields due to their high density, high performance, high reliability, light weight, and small size. Eutectic is an important welding process in microelectronics assembly technology, and it is more and more widely used in microwave multi-chip components, especially in millimeter wave high frequency and high power microwave devices. [0003] At present, eutectic welding generally adopts manual eutectic method, eutectic furnace sintering method, and automatic eutectic placement machine method. Among them, eutectic furnace sintering method and automatic eutectic placement machine method are due to high equipment purchase costs and are suitable for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L24/83H01L2224/8301H01L2224/83013H01L2224/83805
Inventor 李强洪火锋赵影窦增昌何宏玉梁曰坤
Owner 中科迪高微波系统有限公司
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