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A kind of inhibitor and electroplating copper bath for copper interconnect HDI electroplating hole filling

A technology of electroplating hole filling and inhibitors, which is applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of thick copper plating surface deposition thickness, narrow additive operation window, unsuitable for large-scale production, etc. Long service life, wide operating window, and the effect of improving production efficiency

Active Publication Date: 2019-11-05
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, Professor Weiping Dou of Chung Hsing University in Taiwan uses PEG as an inhibitor, sodium polydithiodipropane sulfonate (SPS) and sodium 3-mercapto-1-propane sulfonate (MPS) as accelerators, and Janus Green B (Janus Green B , JGB) and diazine black (DiazineBlack, DB) as leveling agent ([1]W.p.Dow et al.Electrochim.Acta.53(2008)3610–3619.[2]W.-P.Dow et al. / Electrochimica Acta 54(2009)5894–5901.[3]W.P.Dow et al.J.Electrochem.Soc.152(2005)C425-C434.[4]W.P.Dow et al.Electrochem.Solid-State Lett.9(2006) C134-C1 37.), and in an acidic system with an appropriate amount of chloride ions, a large number of experiments have been done on copper-filled micro-blind vias with different thickness-to-diameter ratios, but the above-mentioned system with PEG as an inhibitor will exist Copper plating surface is thick, the operating window of additives is narrow, and the service life of the plating solution is low, so it is not suitable for mass production

Method used

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  • A kind of inhibitor and electroplating copper bath for copper interconnect HDI electroplating hole filling
  • A kind of inhibitor and electroplating copper bath for copper interconnect HDI electroplating hole filling
  • A kind of inhibitor and electroplating copper bath for copper interconnect HDI electroplating hole filling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation of inhibitor: first add 100g analytically pure sulfuric acid to 2000g ultrapure water to prepare about 5% sulfuric acid solution, then add 10g inhibitor to 1000ml 5% sulfuric acid solution, stir for 10min at 30℃, and prepare the inhibitor Agent

[0021] Preparation of accelerator: first add 1g of sodium polydithiodipropane sulfonate to 500g of 5% sulfuric acid solution and stir at 30°C for 10 minutes; then add 5% sulfuric acid solution to make the volume to 1L, continue stirring for 1h, Prepared accelerator;

[0022] Preparation of copper electroplating bath: in 2000mL acid copper electroplating solution (containing 220g / L CuSO 4 ·5H 2 O, 55gH 2 SO 4 And 60mg / L Cl - ), add 40ml inhibitor and 12ml accelerator in sequence, and stir for 5 minutes to obtain a copper electroplating bath;

[0023] The pre-treatment process of electroplating is: board loading, degreasing, water washing, micro-etching, water washing, copper plating, etc. The corrosion inhibitor in the mic...

Embodiment 2

[0027] Take 120×75μm (where the hole diameter is 120μm) blind hole type as an example:

[0028] Using the same inhibitor configuration and copper electroplating bath configuration as in Example 1,

[0029] Preparation of accelerator: Add 1g of sodium alcohol thiopropane sulfonate to 1000g of 5% sulfuric acid solution and stir at 30°C for 15 minutes to prepare accelerator;

[0030] Control the plating bath temperature to 20℃, control the cathode current density to 2ASD, and continue electroplating for 30 minutes. The entire electroplating process is completed under 2.5NL / min aeration. After the electroplating is completed, remove the cathode blind hole plate, rinse with a large amount of distilled water, and dry it with cold air. Obtained samples; the metallographic micrographs of the blind hole section of the electroplated hole-filled sample prepared by this embodiment are as follows figure 2 As shown, the surface copper thickness is 8.9μm.

Embodiment 3

[0032] Taking the 0.3mm×3.0mm (where the hole diameter is 0.3mm) through-hole hole type as an example, the inhibitor, accelerator and copper electroplating bath preparation and experimental conditions are as shown in Example 2. The electroplated through hole prepared by this embodiment The metallographic micrograph of the blind hole section of the sample is as follows image 3 As shown; the copper thickness at the center point of the through hole is 7.3μm.

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Abstract

The invention belongs to the technical field of printed circuit board electroplating, and provides an inhibitor and an electroplating copper bath for copper interconnect HDI electroplating and hole filling; the inhibitor of the invention is an organic polyamine compound, and its molecular structure is: R 1 ,R 2 It is phenyl, methyl, methoxyphenyl or phenyl derivatives; the inhibitor of the present invention has the ability to quickly fill copper at the bottom of the blind hole of the HDI board while inhibiting the growth rate of copper on the HDI board surface, so as to achieve the goal of filling copper after plating , the surface copper thickness is thinner, in addition, it also has the advantages of wide additive operating window and long service life of the plating solution.

Description

Technical field [0001] The invention belongs to the technical field of printed circuit board electroplating, and relates to a micro blind hole hole filling copper plating process, in particular to an inhibitor and an electroplating copper bath for copper interconnect HDI electroplating hole filling. Background technique [0002] PCB board electroplating process is a tedious job. With more and more layers, smaller and smaller via diameters (through holes and blind holes), higher performance materials and power lines in the electroplating system The uneven distribution with the orifices has caused the current technical difficulty to increase sharply. For example, HDI printed circuit boards and integrated circuit packaging substrates require high-density wiring, through-hole apertures and micro-blind holes. <100μm; In addition, in printed circuit boards, it is also required to conduct through-hole electroplating and blind hole copper filling at the same time; therefore, the electr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38H05K3/42
CPCC25D3/38H05K3/423H05K2203/0713
Inventor 陶志华何为李婧张岱南王守绪陈苑明
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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