High-thermal conductivity weather-resistant packaging material for microprocessors, and preparation method thereof

Abstract

The invention discloses a high-thermal conductivity weather-resistant packaging material for microprocessors. The high-thermal conductivity weather-resistant packaging material for microprocessors comprises, by weight, 50-60 parts of unsaturated polyester resin, 12-18 parts of an ethylene-methacrylic acid copolymer, 5-7 parts of nano-oxide, 4-8 parts of ethylene glycol, 10-14 parts of silicone oil, 10-14 parts of a flame-retardant additive, 8-10 parts of a synergist aid, 1-3 parts of boron nitride, 4-6 parts of silicon carbide, 6-8 parts of graphene and 3-5 parts of a coupling agent. The packaging material has the advantages of good thermal conduction and thermal dissipation effects, low thermal impedance, good weather resistance, good flame retardation property and good sealing effect; and a preparation method of the packaging material has the advantages of low material cost, easily available raw materials, simple process, high use values and good application prospect.

Description

technical field [0001] The invention relates to the technical field of microprocessors, in particular to a high thermal conductivity and weather-resistant packaging material for microprocessors and a preparation method thereof. Background technique [0002] With the high power and high integration of integrated circuits, the assembly density of electronic components continues to increase and the geometric size of equipment continues to shrink, and its energy consumption output has increased sharply. Therefore, in order to ensure the reliability and long service life of sensitive devices, the research on thermally conductive insulating materials that can discharge the heat generated by heating electronic components in time is becoming more and more important. [0003] In order to solve the problem of heat conduction and heat dissipation of electronic components, the industry installs radiators on the surface of electronic components to dissipate heat. The gap between the radi...

AI Technical Summary

Problems solved by technology

However, in the actual use process, the contact surface of the three layers of CPU-silicon grease-heat sink cannot reach the ideal flat surface after bonding, and there is still air in the interface gap, which increases the interface thermal resistance and seriously hinders heat conduction. Moreover, in the process of applying silicone grease, the thickness of the application of silicone grease cannot be well controlled, which affects the overall heat dissipation effect, resulting in unsatisfactory heat conduction and heat dissipation efficiency

[0004] On the other hand, as the performance requirements of processors in the market are getting higher and higher, the power consumption of corresponding silicon chips is also increasing, and the problem of heat dissipation needs to be solved urgently. According to statistics, processor failures caused by overheating account for more 60% of the total; the ideal state for the thermal conductivity material to exert the best thermal conductivity effect is to be in close contact with the heat source. Today's packaging materials have low thermal conductivity, poor weather resistance, short service life, and the risk of fire