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Resistor device and method for producing resistor device

A manufacturing method and technology of resistors, applied in the direction of resistors, thick film resistors, resistor parts, etc., can solve problems such as solder cracks, peeling of substrates and heat sinks, etc., to prevent peeling, excellent heat resistance, The effect of suppressing bending stress

Active Publication Date: 2017-08-29
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, in the conventional bonding method, such as Patent Document 1, when the substrate and the heat sink are bonded by solder, if the bending is corrected by pressing in the subsequent process, solder cracks are likely to occur, and there is a possibility that the substrate and the heat sink are peeled off. worry

Method used

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  • Resistor device and method for producing resistor device
  • Resistor device and method for producing resistor device
  • Resistor device and method for producing resistor device

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Effect test

Embodiment

[0153] Hereinafter, the result of the confirmation experiment performed to confirm the effect of the present invention will be described.

[0154] (Inventive Examples 1 to 5)

[0155] On one side of a ceramic substrate (15 mm×11 mm×0.635 mmt) made of AlN, a Ta-Si resistor element (10 mm×10 mm×0.5 μm) was formed by a sputtering method. Next, after forming Cu films on both ends of the resistance element by sputtering, Cu electrodes (2 mm×10 mm) with a thickness of 1.6 μm were formed by electroplating. Next, on the other side of the ceramic substrate, a heat sink (20mm×13mm×3mmt) made of Al alloy (A1050) is laminated via Al-Si based solder foil, and the welding pressure is increased to 3kgf / cm in the lamination direction 2 , In a vacuum atmosphere, kept at 645°C for 30 minutes, and bonded the ceramic substrate and the heat sink with Al-Si brazing filler metal. In addition, the opposite surface of the heat sink is corrected to a predetermined degree of curvature (amount of warpage) by...

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Abstract

This resistor device is provided with: a chip resistor that comprises a resistor formed on one surface of a ceramic substrate and a metal electrode; a metal terminal that is electrically connected to the metal electrode; and an Al member that is formed on the other surface of the ceramic substrate. The ceramic substrate and the Al member are bonded with each other by means of an Al-Si brazing material, while the metal electrode and the metal terminal are bonded with each other by means of a solder. The reverse surface of the Al member, said reverse surface being on the reverse side of the ceramic substrate-side surface, has a curvature degree within the range of from -30 [mu]m / 50 mm to 700 [mu]m / 50 mm (inclusive).

Description

Technical field [0001] The present invention relates to a resistor and a method of manufacturing the resistor. The resistor includes: a chip resistance element having a resistance element and a metal electrode formed on one side of a ceramic substrate; a metal terminal joined to the metal electrode; and Al parts made of Al or Al alloy. [0002] This application claims priority based on Patent Application No. 2015-014405 filed in Japan on January 28, 2015, and uses the content here. Background technique [0003] As an example of an electronic circuit component, a resistor including a resistance element formed on one surface of a ceramic substrate and a metal terminal joined to the resistance element is widely used. The resistor generates Joule heat in accordance with the applied current value, so that the resistor emits heat. In order to effectively diffuse the heat generated by the resistor, for example, a resistor provided with a heat sink (heat sink) has been proposed. [0004] ...

Claims

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Application Information

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IPC IPC(8): H01C1/084H01C1/142H01C17/02H01C17/28
CPCH01C1/084H01C17/02H01C17/28H01C1/028H01C1/012H01C1/144H01C7/003H01C17/006H01C1/142
Inventor 长瀬敏之驹崎雅人
Owner MITSUBISHI MATERIALS CORP
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