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Electronic component

A technology of electronic components and electrodes, which is applied to fixed capacitor parts, electrical components, transformer/inductor parts, etc., can solve the problems of reduced quality and reliability, larger distance between electrodes, performance degradation, etc., to achieve reliable suppression Sexual reduction, crack prevention effect

Active Publication Date: 2017-08-15
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the reliability of the quality is reduced
On the other hand, in order to ensure the quality, if the thickness of the inorganic dielectric layer is uniformly increased, the distance between the electrodes increases, resulting in a reduction in the capacitance of the capacitor, and there is a problem that performance degradation occurs.

Method used

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no. 1 approach

[0043] figure 1 It is a cross-sectional view showing the first embodiment of the electronic component of the present invention. Figure 2A yes figure 1 A-A sectional view of . Figure 2B yes figure 1 BB sectional view of . Figure 2C yes figure 1 C-C sectional view of . image 3 is an equivalent circuit diagram of an electronic component.

[0044] Such as figure 1 with Figure 2A ~ Figure 2C with image 3 As shown, the electronic component 10 is an LC composite electronic component having a coil 2 and a capacitor 3 . The electronic component 10 is mounted, for example, on electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and in-vehicle electronic devices. The electronic component 10 is used, for example, as an LC filter such as a low-pass filter, a high-pass filter, a band-pass filter, or a notch filter.

[0045] The electronic component 10 has a substrate 1 , a coil 2 and a capacitor 3 which are provided on the substra...

no. 2 approach

[0082] Image 6 It is a cross-sectional view showing a second embodiment of the electronic component of the present invention. The second embodiment differs from the first embodiment only in the position of the coil. This different configuration will be described below. In addition, in the second embodiment, since the same symbols as in the first embodiment represent the same configuration as in the first embodiment, description thereof will be omitted.

[0083] Such as Image 6 As shown, in the electronic component 10A of the second embodiment, the first coil portion 21 of the coil 2 is provided on the same layer as the lower electrode 31 . In addition, in Image 6 In FIG. 1 , drawing of the second coil portion 22 of the coil 2 is omitted, and the second coil portion 22 may be provided on the inorganic dielectric layer 5 or may be provided on the second insulating layer 42 .

[0084] The upper surface of the first coil portion 21 is at the same height as the upper surfac...

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Abstract

An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.

Description

technical field [0001] The present invention relates to electronic components. Background technique [0002] Conventionally, as an electronic component, there exists a component described in Unexamined-Japanese-Patent No. 2008-34626 (patent document 1). This electronic component has a substrate, a lower electrode for a capacitor provided on the substrate, a coil provided on the substrate, an inorganic dielectric layer covering the coil, the substrate, and the lower electrode, and a An upper electrode for a capacitor with a layer facing the lower electrode. The thickness of the inorganic dielectric layer is constant, and the inorganic dielectric layer is formed according to the shapes of the coil, the substrate, and the lower electrode. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2008-34626 [0004] However, when the above-mentioned conventional electronic components are actually manufactured and used, the following problems are found. [0005] If the inorga...

Claims

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Application Information

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IPC IPC(8): H01F27/00H01G17/00H01G4/08
CPCH01F27/00H01G4/08H01G17/00H03H2001/0078H03H2001/0085H01F17/0013H01F2017/0026H01G4/33H01G4/1272H01G4/129H01G4/012H01G4/40H03H7/0115H01F27/2804H01F27/40H01F2027/2809
Inventor 工藤敬实西山健次大仓辽
Owner MURATA MFG CO LTD
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