Metal or alloy product micro-hole machining system

Abstract

The invention provides a metal or alloy product micro-hole machining system, and relates to the field of micro-hole machining. The metal or alloy product micro-hole machining system comprises an ultrashort laser pulse generator, a laser status adjustment device, a Gaussian laser pulse generation device, an annular laser pulse generation device and a laser pulse synthesizer; the discharge time of first-time plasmas is shortened, residues in the discharge process of the first-time plasmas are reduced, the micro-hole hole wall smooth degree is improved, and the micro-hole punching limit depth is increased; small energy pulse laser energy injection is achieved at two times, compared with same-total-amount once large-energy pulse lasers, and reduction of the size of the micro-hole caliber is facilitated; and meanwhile, the cracking possibility is reduced, the ratio of the diameter of a center ring line of an annular light spot of a focused second laser beam to the diameter of a center ring line of a Gaussian light spot of a focused first laser beam is larger than 1, and the laser energy injection efficiency can be improved.

Description

technical field [0001] The invention relates to the field of micro-hole machining, in particular to a micro-hole machining system for metal or alloy products. Background technique [0002] In the field of micro-hole processing of metal and alloy materials, laser micro-deep hole processing technology is widely used in turbine blades, oil pumps, nozzles, filters, spinnerets, water jets, molds, medical appliances, watch parts, printed circuit boards And other micro hole machining field. For ordinary long-pulse laser processing, such as ns laser, the ratio of depth to diameter is about 10 when the aperture is ~50um, and the surface roughness of the processed hole wall is poor; another example is excimer laser, but the processing speed is extremely slow, and the processing cost High, processing um-level holes is only suitable for processing um-level films. Ordinary UV laser can achieve smaller micropore diameter scale under low pulse energy, but the micropore depth is difficult...

AI Technical Summary

Problems solved by technology

[0004] In femtosecond laser microhole processing in the prior art, due to the influence of critical plasma shielding, the limit depth of small holes is usually within 300um, which is not deep enough, and the ablation aperture is above 100um, which is relatively large , the thickness of the recast layer is thick, there are many thick cracks, and the utilization rate of ultrashort laser pulse energy is low

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