Micropore machining method for metal or alloy product

Abstract

The invention provides a micropore machining method for a metal or alloy product, and relates to the field of micropore machining. According to the machining method for the metal or alloy product, the primary plasma discharging time is shortened, residues in the primary plasma discharging process are reduced, the smooth degree of the pore walls of micropores is increased, and the punching limit depth of the micropores is increased; low-energy pulse laser machining is conducted two times for achieving energy injection, and compared with single-time high-energy pulse laser machining with the same total energy, the micropore diameter size can be increased more easily, and meanwhile the possibility of generating cracks is decreased; in addition, the ratio of the diameter of the central ring line of an annular laser spot of a second focused laser beam to the diameter of the central ring line of a Gauss laser spot formed by a first focused laser beam is larger than 1, and therefore the laser energy injection efficiency can be improved.

Description

technical field [0001] The invention relates to the field of micro-hole machining, in particular to a method for micro-hole machining of metal or alloy products. Background technique [0002] In the field of micro-hole processing of metal and alloy materials, laser micro-deep hole processing technology is widely used in turbine blades, oil pumps, nozzles, filters, spinnerets, water jets, molds, medical appliances, watch parts, printed circuit boards, etc. Microhole processing field. Since the femtosecond laser was born in the 1980s, various ultrashort laser pulses, especially femtosecond pulse lasers, have been widely used in physics, chemistry, mechanics and biology. The laser wavelength covers almost infrared to extreme ultraviolet band, and the pulse width is also reduced to a few photoperiods. Since the processing mechanism of the femtosecond laser is different from the previous long-pulse laser processing, all its energy can be injected into a small active area (usual...

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Problems solved by technology

[0003] In femtosecond laser microhole processing in the prior art, due to the influence of critical plasma shielding, the limit depth of small holes is usually within 300um, which is not deep enough, and the ablation aperture is above 100um, which is relatively large , the thickness of the recast layer is thick, there are many thick cracks, and the utilization rate of ultrashort laser pulse energy is low

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