Flexible pressure sensor manufacturing method based on V-shaped groove array electrode
A pressure sensor and array electrode technology, applied in the field of flexible sensing and micro-nano systems, can solve the problems of easy breakage of metal electrodes, sensor failure, easy detachment of metal materials and flexible substrates, etc., to improve sensitivity and enhance adhesion. additive effect
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[0031] The fabrication process of the flexible pressure sensor is as follows: figure 1 As shown, the process is simply summarized as: (1) oxidation; (2) photolithography; (3) wet etching; (4) nanoimprinting; (5) PDMS inversion; (6) sputtering, packaging.
[0032] Fabrication of "V" Groove Array Electrodes for Flexible Pressure Sensors
[0033] A single-side polished 4-inch -side N-type silicon oxide wafer (Suzhou Ruicai Semiconductor Co., Ltd.), with a resistance of 2-5Ω and a thickness of 500μm. Use H respectively in the thousand-class clean room 2 SO 4 (concentrated): H 2 o 2 =3:1, SC1 solution, SC2 solution to clean the silicon wafer to remove surface hydrocarbons, alkali ions, and metal pollutants. In order to prevent the surface of the silicon wafer from absorbing water to produce pinholes and air bubbles in the photoresist, causing the drift of the photoresist to damage the photolithographic pattern, the silicon wafer was placed in an HMDS oven and baked at 135°C fo...
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