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A high-temperature tensile sample grinding and polishing device and its application method

A technology for tensile specimens and grinding and polishing, which is applied in the direction of grinding/polishing equipment, preparation of test samples, grinding machines, etc. It can solve the problems of difficult polishing, uneven force, and impact on results, and achieve flexible use , prevent the effect of moving and falling

Inactive Publication Date: 2019-04-05
NORTHEASTERN UNIV LIAONING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] (2) It is difficult to polish the sample during polishing
[0017] Because the high-temperature tensile sample is relatively thin and the size of the sample is small, it is difficult to hold it by hand under the high speed of the polishing machine during the polishing process, and the polishing is difficult. If the sample flies out during the polishing process, it is easy to hurt people
[0018] (3) The surface grinding and polishing waves produced by the polishing process are difficult to remove
[0019] During the polishing process, the tensile sample should be kept flat on the surface of the polishing disc. Under the high speed of the polishing machine, the sample can only be pressed by hand, but because the force exerted by the fingers on the sample is not uniform, the tensile sample The stress area along the length direction is uneven, the sample polishing degree is different, and the surface is prone to wavy lines. These defects are difficult to eliminate and have a great impact on subsequent high-temperature observations.
The surface quality, roughness, and scratches of tensile samples are difficult to control, and the success rate of experiments is low
[0020] (4) Uneven stress on the sample along the stretching direction
[0021] During the polishing process, press the surface of the sample with your finger, because the force applied by the finger to the sample is not uniform, resulting in uneven force on the sample along the stretching direction, and the sample has different degrees of grinding and polishing along the stretching direction, resulting in The thickness along the stretching direction is uneven, and some places will be worn thinner, which will have a great impact on the results of subsequent high-temperature stretching experiments
It cannot reflect the real tensile strength and fracture area of ​​the material, and the experimental data cannot be repeated
[0022] (5) The observation port fluctuated during the experiment at high temperature, and it was impossible to observe clearly in real time
But at the same time, if the surface roughness of the sample is large, there are defects such as wave grinding and scratches, etc., the high-speed airflow will blow the high-temperature metallographic image during the heating process, which will cause the high-temperature metallographic image to shake, and the brightness of the field of view will change too obviously to be clear. Stable imaging, unable to clearly observe the changes of the sample surface at high temperature in real time

Method used

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  • A high-temperature tensile sample grinding and polishing device and its application method
  • A high-temperature tensile sample grinding and polishing device and its application method
  • A high-temperature tensile sample grinding and polishing device and its application method

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Embodiment Construction

[0053] The present invention will be described in further detail below in conjunction with embodiment.

[0054] Such as figure 1 , Figure 2(a)-Figure 2(d) As shown, the high temperature tensile sample grinding and polishing device of the present invention mainly includes: grinding and polishing device main body 1, NdFeB strong magnet 2, cover 3, non-magnetic bolt 4, fixed nut 5, bolt 6, first pull Tensile sample groove 7, second tensile sample groove 8, adsorption limit device installation groove 9, diversion groove 10, tensile sample installation column 11, etc. The main body 1 and cover 3 of the grinding and polishing device are made of 304 stainless steel , the specific structure is as follows:

[0055] One side surface of the grinding and polishing device main body 1 is provided with the first tensile sample groove 7 and the second tensile sample groove 8 arranged crosswise, and in the first tensile sample groove 7 and the second tensile sample groove 8 Tensile sample ...

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Abstract

The invention belongs to the field of sample grinding and polishing, and specifically relates to a high-temperature tensile sample grinding and polishing device and its use method. The device includes: the main body of the grinding and polishing device, the NdFeB strong magnet, the cover, the first tensile sample tank, the second tensile sample tank, and the installation slot of the adsorption limiting device. The specific structure is as follows: The main body of the grinding and polishing device The surface of one side is provided with the first tensile specimen groove and the second tensile specimen groove arranged crosswise. The other side of the main body of the grinding and polishing device is equipped with a cover. A hollow groove is provided in the middle of the main body of the grinding and polishing device as a neodymium iron. The adsorption limiter installation groove of the boron strong magnet is installed in the adsorption limiter installation groove, and the neodymium iron boron strong magnet is installed in the adsorption limiter installation groove. The device of the invention is simple to operate, has high efficiency in grinding and polishing the tensile specimen, greatly improves the surface quality of the grinding and polishing tensile specimen, and is more conducive to high-temperature tensile testing of the tensile specimen.

Description

Technical field: [0001] The invention belongs to the field of sample grinding and polishing, and in particular relates to a high-temperature tensile sample grinding and polishing device and a use method thereof. Background technique: [0002] In the process of grinding and polishing the tensile specimens of thin plates, strips, and thin plates, the surface of the tensile specimens needs to be cleaned (remove the oxide layer and decarburization layer), and the surface roughness of the parallel sections of the tensile specimens should be as rough as possible. Small, the grinding and polishing thickness of the sample along the stretching direction should be as uniform as possible. If the grinding and polishing thickness of the sample along the stretching direction is uneven, the sample will break first at the thinner part during the stretching process, resulting in inaccurate experimental results. question. Some tensile samples are non-standard samples, such as: high-temperatu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B19/00B24B41/06G01N1/32
CPCB24B19/00B24B41/06G01N1/32
Inventor 申勇峰宋晓童薛文颖
Owner NORTHEASTERN UNIV LIAONING
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