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BGA package fixing structure of LED module

A technology of LED module and fixed structure, which is applied in the field of LED light sources, can solve the problems of unfavorable heat dissipation, aging of phosphor powder, and influence of heat dissipation, etc., and achieve the effect of reducing parasitic parameters, small signal transmission delay, and expanding application fields

Active Publication Date: 2017-06-27
FUJIAN XIANGYUN PHOTOELECTRIC TECH
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  • Summary
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of this common method is to save materials, but the disadvantage is that it is not conducive to heat dissipation, and the phosphor will also age.
Because epoxy resin and phosphor are not materials with good thermal conductivity, and wrapping the entire chip will affect heat dissipation
This method is obviously not the best solution for manufacturing LED lighting fixtures

Method used

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  • BGA package fixing structure of LED module
  • BGA package fixing structure of LED module
  • BGA package fixing structure of LED module

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Embodiment Construction

[0039] Such as Figure 1-5As shown, the LED module BGA package fixing structure, the BGA package fixing structure includes the LED module 9 in the BGA package form, the PCB board 10 and the BGA mounting and welding fixture; the LED module 9 is a light source device in the BGA package The LED module includes a BGA packaging substrate 2, an LSI chip 1, and a bump array 4; the bump array 4 is composed of a plurality of spherical or columnar solder joints 3 arranged in a predetermined arrangement on the soldering surface of the BGA packaging substrate 2 Composition; the bump array 4 is located on the back of the BGA packaging substrate 2; the LSI chip 1 is located on the front of the BGA packaging substrate 2; the LSI chip is provided with an LED light-emitting tube and supporting circuits that are packaged and fixed with molded or filled resin materials ; The electrical connection between the LSI chip and the bump array; the PCB board 10 is provided with a BGA light source pad 5;...

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Abstract

The invention provides the BGA package fixing structure of an LED module, which comprises an LED module, a PCB and a BGA surface-mount welding jig. The LED module is a light source device of a BGA package. The welding spots of a salient point array are positioned on the back surface of a BGA package substrate. An LSI chip is located on the front surface of the BGA package substrate. An LED light-emitting tube and a matching circuit, which are packaged and fixed by the mold or filled resin material, are arranged Inside the LSI chip. The LSI chip is electrically connected with the salient point array. The PCB is provided with a BGA light-source bonding pad. The BGA surface-mount welding jig is a positioning plate. The positioning plate is provided with more than one light source fixing hole. During the surface-mounting or welding process of the LED module, the positioning plate is detachably fixed on the PCB. The LED module is subjected to surface-mounting positioning or welding positioning on the PCB through the light source fixing hole. When the LED module is welded and fixed on the PCB, the positioning plate is taken down. According to the technical scheme of the invention, high-availability LED light sources can be manufactured through the BGA package.

Description

technical field [0001] The invention relates to the technical field of LED light sources, in particular to a BGA packaging and fixing structure for LED modules. Background technique [0002] At present, there are several packaging methods for LEDs: bracket row packaging, patch packaging, and module packaging. These packaging methods are common and commonly used by us. [0003] Bracket row packaging was the first to be used to produce a single LED device. This is our common lead-type light-emitting diode (including piranha packaging), which is suitable for instrument indicator lights, urban lighting projects, advertising screens, guardrail tubes, traffic Indicator lights, and some products and fields that are currently widely used in our country. [0004] SMD package (SMD) is a leadless package, small and thin, very suitable for keyboard display lighting of mobile phones, backlighting of TV sets, and electronic products that require lighting or indication. In recent years, S...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/54
CPCH01L25/0753H01L33/48H01L33/54
Inventor 林春仁檀灵真
Owner FUJIAN XIANGYUN PHOTOELECTRIC TECH
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