Silver-free brass solder alloy

A brass brazing filler metal and alloy technology, applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problems of strength index reduction, copper annealing, excessive grain growth, etc., to improve mechanical properties , the effect of reducing the melting temperature and improving the wettability

Inactive Publication Date: 2017-05-31
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the inherent brittleness and microcracks of Fe-Si and Fe-P intermetallic compounds, the reliability of the brazing joint service process (such as: air tightness, electrical conductivity and mechanical properties) will be reduced.
Secondly, due to the high melting point of the existing brass solder, when brazing similar steel / copper joints, the annealing of copper is severe, causing excessive growth of grains, resulting in a decrease in strength indicators

Method used

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  • Silver-free brass solder alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A silver-free brass solder alloy, calculated by weight percentage, comprising the following raw materials:

[0027] 53% copper, 1.5% tin, 0.2% indium, 2.6% nickel, 0.005% La, 0.005% Pr and 4% manganese, and the balance is zinc.

[0028] Preparation:

[0029] 1) Prepare a total of 5000 grams of each material according to the above formula;

[0030] 2) Put Cu into an induction furnace and heat it to above 1100°C and melt it;

[0031] 3) Add Zn and stir fully, while rapidly reducing the temperature of the molten metal to 920°C;

[0032] 4) After the molten metal is uniform, add Mn and In and stir thoroughly;

[0033] 5) Add Sn, Ni, La and Pr and stir evenly, then cast;

[0034] 6) The brazing alloy is obtained by extruding and wire drawing according to the conventional brazing filler metal processing method.

Embodiment 2

[0036] A silver-free brass solder alloy, calculated by weight percentage, comprising the following raw materials:

[0037] 50% copper, 3% tin, 0.4% indium, 3% nickel, 0.01% Er, 0.01% Dy, 5% manganese, and the balance is zinc.

[0038] The preparation method of the silver-free brass solder alloy in this embodiment is consistent with the method described in Example 1, the difference is only the weight percentage of each component of the silver-free brass solder alloy and the ratio of rare earth elements in this embodiment Weigh.

Embodiment 3

[0040] A silver-free brass solder alloy, calculated by weight percentage, comprising the following raw materials:

[0041] Copper 56%, tin 0.5%, indium 0.08%, nickel 1%, Dy 0.001%, Nd 0.003%, manganese 2.2%, and the balance is zinc.

[0042] The preparation method of the silver-free brass solder alloy in this embodiment is consistent with the method described in Example 1, the difference is only the weight percentage of each component of the silver-free brass solder alloy and the ratio of rare earth elements in this embodiment Weigh.

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PUM

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Abstract

The invention provides a silver-free brass solder alloy. The silver-free brass solder alloy is prepared from the following raw materials in percentage by weight: 50 to 56 percent of copper, 0.5 to 3 percent of tin, 0.06 to 0.4 percent of indium, 1 to 4 percent of nickel, 0.004 to 0.02 percent of rare earth elements, 2 to 6 percent of manganese, and the balance of zinc, wherein the rare earth elements are two of La, Pr, Er, Dy or Nd. The silver-free brass solder alloy does not contain silver or cadmium and has the advantage of high activity; a melting point of a traditional brass solder can be reduced.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to a silver-free brass solder alloy. Background technique [0002] The materials used in the hardware tool industry mainly include hard alloys, diamonds, and iron bodies. The workpieces of these materials are mostly brass-type solders when welding. Due to the high melting point of brass, it is not conducive to the welding of workpieces. Since the addition of silver can effectively reduce the melting point of the brass solder and effectively improve the brazing fluidity of the brass solder, in the prior art, most brazing filler metals of the brass matrix contain silver. The addition of silver can reduce the melting point of brass solder, and the most commonly used silver content in silver brass solder is 2%, 5%, 10%, 15%, 20%, 30%, 35%, 40%, 45%, 50%, etc., but because silver is a precious metal, its price is higher, so adding silver to the brass solder increa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
CPCB23K35/302
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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