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Low-melting-point and low-cadmium sliver brazing filler metal

A low-melting-point silver solder technology, applied in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems of limited annual output, difficult processing of silver solder, and lack of mass application, etc., to achieve The effect of reducing the content, avoiding oxidation or even softening of the workpiece, and good wetting and spreading properties

Active Publication Date: 2017-05-31
CHANGSHU HUAYIN FILLER METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since Ga and In are rare elements, the annual output of the world is very limited, and the price is equivalent to or even higher than silver, so they do not have the value of mass application; Easy to form hard and brittle intermetallic compound Cu 6 sn 5 , making it difficult to process silver solder. Except that the addition of Sn in BAg60CuSn solder can reach 9.5% to 10.5%, the general addition in Ag-Cu-Zn-Sn series solder is 1.5% to 2.5%. Some, such as BAg56CuZnSn, the amount of Sn added is 4.5% to 5.5% (see GB / T10046-2008 "Silver Solder" Table 2)
[0005] However, the main components in the prior art including the aforementioned patent documents are Ag, Cu, Zn elements (does not contain phosphorus elements, classified as silver solder in GB / T 10046-2008) and Ga, In, Sn elements All silver solders with a content of less than 0.15% are not enough to make the liquidus temperature ≤ 710 ° C, so as to approach the "cadmium-free silver solder" with a liquidus temperature of 682 ° C of BAg25CuZnCd solder

Method used

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  • Low-melting-point and low-cadmium sliver brazing filler metal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The chemical composition is: 24.0% Ag, 41.0% Cu, 0.05% Cd, 0.001% In, 0.005% Ga, and the balance is Zn.

[0020] The solidus temperature of the low-melting-point low-cadmium silver solder obtained in this example is in the range of 630° C. to 645° C., and the liquidus temperature is in the range of 695° C. to 710° C. (measurement errors are considered). See the data in brackets for the strength of the brazing seam when the flame brazing method is used, with FB102 flux, and the brazing base material is the following combination: red copper-H62 brass (σ b =225±25MPa, τ=215±30MPa), brass-Q235 steel (σ b =280±25MPa, τ=300±30MPa), brass-304 stainless steel (σ b =260±25MPa, τ=280±30MPa).

Embodiment 2

[0022] The chemical composition is: 26.0% Ag, 30.0% Cu, 0.13% Cd, 0.001% In, 0.001% Ga, and the balance is Zn.

[0023] The solidus temperature of the low-melting-point low-cadmium silver solder obtained in this example is in the range of 630° C. to 645° C., and the liquidus temperature is in the range of 695° C. to 710° C. (measurement errors are considered). See the data in brackets for the strength of the brazing seam when the flame brazing method is used, with FB102 flux, and the brazing base material is the following combination: red copper-H62 brass (σ b =225±25MPa, τ=215±30MPa), brass-Q235 steel (σ b =280±25MPa, τ=300±30MPa), brass-304 stainless steel (σ b=260±25MPa, τ=280±30MPa).

Embodiment 3

[0025] The chemical composition is: 25.0% Ag, 36.0% Cu, 0.10% Cd, 0.005% In, 0.005% Ga, and the balance is Zn.

[0026] The solidus temperature of the low-melting-point low-cadmium silver solder obtained in this example is in the range of 630° C. to 645° C., and the liquidus temperature is in the range of 695° C. to 710° C. (measurement errors are considered). See the data in brackets for the strength of the brazing seam when the flame brazing method is used, with FB102 flux, and the brazing base material is the following combination: red copper-H62 brass (σ b =225±25MPa, τ=215±30MPa), brass-Q235 steel (σ b =280±25MPa, τ=300±30MPa), brass-304 stainless steel (σ b =260±25MPa, τ=280±30MPa).

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Abstract

The invention provides low-melting-point and low-cadmium sliver brazing filler metal, and belongs to the technical field of metal brazing materials. The low-melting-point and low-cadmium sliver brazing filler metal is chemically composed of, by mass, 24%-26% of Ag, 30%-41% of Cu, 0.05%-0.13% of Cd, 0.001%-0.005% of In, 0.001%-0.005% of Ga and the balance Zn. The low-melting-point and low-cadmium sliver brazing filler metal has the beneficial effects that good wetting spreadability is achieved, the content of indium and gallium which are used as rare elements is decreased, the element tin is abandoned, and the good brazing seam mechanical property is achieved. Compared with brazing filler metal BAg25CuZn and BAg25CuZnSn, the brazing filler metal has a lower melting temperature range, the brazing filler metal can be easy to operate during brazing, the technical difficulty is lowered for brazing operators, the low-melting-point and low-cadmium sliver brazing filler metal is particularly suitable for brazing of products in industries except industries of electronic and electrical devices limited by the RoHS instruction, and the problems that due to the excessively-high brazing temperature, workpieces are oxidized and even softened and the strength of brazed joints is reduced are avoided.

Description

technical field [0001] The invention belongs to the technical field of metal brazing materials, and in particular relates to a silver solder with low melting point and low cadmium. Background technique [0002] The melting temperature range of the BAg25CuZnCd solder recommended in the existing technology (GB / T 10046-2008 "Silver Solder") is 607°C for the solidus and 682°C for the liquidus, and its "lower" melting temperature range makes it It is easy to operate and process during brazing, and it used to be one of the favorite brazing materials for brazing users. However, due to the restrictions on the use of Cd elements due to the RoHS directive and the No. 39 Order of the Ministry of Environmental Protection of China (implemented on August 1, 2016), the application of BAg25CuZnCd solder has been affected, so the following two solders are used as "Substitutes" for BAg25CuZnCd solder: one is BAg25CuZn solder; the other is BAg25CuZnSn solder. The former (i.e. BAg25CuZn solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24
CPCB23K35/24
Inventor 顾立勇袁维顾文华顾建昌
Owner CHANGSHU HUAYIN FILLER METALS
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