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Low-silver base brazing filler metal and preparation method thereof

A brazing filler metal and silver-copper technology, applied in the field of low-silver-based brazing filler metal and its preparation, can solve the problems of brazing joint corrosion resistance and fatigue resistance that cannot meet the requirements of use, and achieve good fatigue performance, good compactness, The effect of increasing the service life

Inactive Publication Date: 2017-05-10
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a low-silver-based solder and its preparation method, which solves the problem that the existing copper-phosphorus solder has low price but the corrosion resistance and fatigue resistance of the brazed joint cannot meet the requirements for use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment provides a low-silver copper-based solder, which is made of the following raw materials in terms of mass percentage: Ag2.0%, P5.0%, Sn5%, Ni2%, Mn0.15%, In0.2%, and The amount is copper and unavoidable impurities.

[0026] The preparation method of the present embodiment low-silver copper-based solder comprises the following steps:

[0027] (1) Pre-smelting Ni and half of the mass of Cu to make an intermediate alloy Cu-Ni;

[0028] (2) Preselection and smelting of P and half of the mass of Cu to make the master alloy Cu-P;

[0029] (3) Before smelting, Sn is processed, and bulk Sn is prepared into filamentous Sn; Cu-P, Cu-Ni, Mn and In elements are added first when feeding, and Sn is added after complete melting, and the feeding is completed Immediately after adding the covering agent to play the role of heat preservation;

[0030] (4) After smelting, the brazing material is obtained by continuous casting, continuous extrusion, forming and cleaning. ...

Embodiment 2

[0033] This embodiment provides a kind of low-silver copper-based solder, which is made of the following raw materials in terms of mass percentage: Ag1.8%, P5.2%, Sn3%, Ni3%, Mn0.1%, In0.3%, Yu The amount is copper and unavoidable impurities.

[0034] The preparation method of the present embodiment low-silver copper-based solder comprises the following steps:

[0035] (1) Pre-smelting Ni and half of the mass of Cu to make an intermediate alloy Cu-Ni;

[0036] (2) Preselection and smelting of P and half of the mass of Cu to make the master alloy Cu-P;

[0037] (3) Before smelting, Sn is processed, and bulk Sn is prepared into filamentous Sn; Cu-P, Cu-Ni, Mn and In elements are added first when feeding, and Sn is added after complete melting, and the feeding is completed Immediately after adding the covering agent to play the role of heat preservation;

[0038] (4) After smelting, the brazing material is obtained by continuous casting, continuous extrusion, forming and clean...

Embodiment 3

[0041] This embodiment provides a low-silver copper-based solder, which is made of the following raw materials in terms of mass percentage: Ag2.2%, P4.8%, Sn8%, Ni1%, Mn0.2%, In0.1%, and The amount is copper and unavoidable impurities.

[0042] The preparation method of the present embodiment low-silver copper-based solder comprises the following steps:

[0043] (1) Pre-smelting Ni and half of the mass of Cu to make an intermediate alloy Cu-Ni;

[0044] (2) Preselection and smelting of P and half of the mass of Cu to make the master alloy Cu-P;

[0045] (3) Before smelting, Sn is processed, and bulk Sn is prepared into filamentous Sn; Cu-P, Cu-Ni, Mn and In elements are added first when feeding, and Sn is added after complete melting, and the feeding is completed Immediately after adding the covering agent to play the role of heat preservation;

[0046] (4) After smelting, the brazing material is obtained by continuous casting, continuous extrusion, forming and cleaning.

...

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Abstract

The invention provides low-silver base brazing filler metal and a preparation method thereof, and belongs to the technical field of solders. The low-silver copper base brazing filler metal is prepared by the following raw materials in percentage by mass: 1.8-2.2% of Ag, 4.8-5.2% of P, 3-8% of Sn, 1-3% of Ni, 0.1-0.2% of Mn, 0.1-0.3% of In, and the balance of copper and inevitable impurities. The low-silver copper base brazing filler metal is high in mechanical strength, excellent in compactness, low in resistivity, excellent in joint corrosion resistance and creep strength, excellent in brazing process performances after use by customers, stable in brazing joint quality and excellent in fatigue performance, and can effectively prolong the service life of a brazing joint.

Description

technical field [0001] The invention relates to the technical field of solder, in particular to a low silver-based solder and a preparation method thereof. Background technique [0002] Vacuum electronic devices are various in variety, widely used and in great demand, and play a very important role in national production and life. For example: vacuum switching tubes are widely used in electric power, coal, petroleum, chemical and other fields, and the annual demand has reached millions; microwave tubes are mainly used in radar, television, communication, navigation, heating and other fields; X-ray tubes are used in medicine Diagnosis and treatment, non-destructive testing of parts, material structure analysis and other fields. Vacuum electronic devices are made of a variety of materials, mainly including metal materials such as oxygen-free copper, stainless steel, nickel, titanium, and Kovar alloy, and non-metallic materials such as Al2O3 ceramics and glass, which are conne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/302B23K35/40
Inventor 徐炳生刘东枭
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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