Lead-free paste soldering material and preparation method thereof
A technology of welding materials and lead-free solder alloys, which is applied in the direction of welding equipment, welding/cutting media/materials, welding media, etc., can solve the problem of poor reliability of joint strength solder joints, oxides that do not protect the melt, and limit the application of solder alloys, etc. problem, to achieve the effect of improving anti-oxidation performance, excellent reliability, and improving performance
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Embodiment 1
[0026] A lead-free paste soldering material, which is made by mixing lead-free solder alloy powder and flux in a mass ratio of 10:0.9, and the lead-free solder alloy powder is made of the following raw materials: Zn 7wt%, Ti 0.15wt% and graphene 1.8wt%, the balance is Sn; the components of the flux are: 45wt% hydrogenated rosin, 8wt% glutaric acid and 6wt% hydrogenated castor oil, and the balance is benzyl alcohol.
[0027] The preparation method of lead-free solder alloy powder is as follows:
[0028] a. Encapsulate pure zinc ingots, pure titanium ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill with high-purity nitrogen protective gas to 1.1×10 5 Pa, and then the packaged raw materials are put into the reaction furnace for smelting at 650°C for heat treatment, and the melt is completely melted;
[0029] b. Graphene is placed in a stirring ball mill, filled with liquid nitrogen until the balls are completely submerged, then b...
Embodiment 2
[0037] A lead-free paste soldering material, which is made by mixing lead-free solder alloy powder and flux in a mass ratio of 11:1. The lead-free solder alloy powder is made of the following raw materials: Zn 5wt%, Ti 0.2wt% and graphene 02.4wt%, and the balance is Sn; the components of the flux are: hydrogenated rosin glyceride 50wt%, salicylic acid 3wt%, fatty acid amide 1wt%, ethylene bis-stearic acid amide 1wt%, The balance is ethanol.
[0038] The preparation method of lead-free solder alloy powder is as follows:
[0039] a. Encapsulate pure zinc ingots, pure titanium ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill with high-purity nitrogen protective gas to 1.2×10 5 Pa, and then the packaged raw materials are put into the reaction furnace for melting at 670°C heat treatment, and the completely melted melt;
[0040] B, graphene is placed in the agitating ball mill, after filling liquid nitrogen to completely immerse th...
Embodiment 3
[0048] A lead-free paste soldering material, which is made by mixing lead-free solder alloy powder and flux in a mass ratio of 11:1.2, and the lead-free solder alloy powder is made of the following raw materials: Zn 10wt%, Ti 0.1wt% and graphene 0.6wt%, the balance is Sn; the components of the flux are: 40wt% methyl styrene resin, 12wt% salicylic acid and 8wt% polyethylene wax, and the balance is diethylene glycol.
[0049] The preparation method of lead-free solder alloy powder is as follows:
[0050] a. Encapsulate pure zinc ingots, pure titanium ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill with high-purity nitrogen protective gas to 1.2×10 5 Pa, and then the packaged raw materials are put into the reaction furnace for melting at 670°C heat treatment, and the completely melted melt;
[0051] B, graphene is placed in the agitating ball mill, after filling liquid nitrogen to completely immerse the grinding ball, carry out ...
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