Photosensitive composition for permanent films, resist material and coating film

A photosensitive composition and permanent film technology, which is applied to photosensitive materials, coatings, optics and other directions for optomechanical equipment, can solve problems such as permanent film contamination, and achieve non-susceptibility to contamination, excellent moisture absorption and contamination resistance. , Excellent hygroscopicity

Inactive Publication Date: 2017-02-22
DIC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that, in a high-temperature environment, the permanent film and its surrounding members adhere to the monomer components sublimated from the permanent film and become contaminated.

Method used

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  • Photosensitive composition for permanent films, resist material and coating film
  • Photosensitive composition for permanent films, resist material and coating film
  • Photosensitive composition for permanent films, resist material and coating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0098] Hereinafter, although an Example etc. are given and this invention is demonstrated in detail, this invention is not limited to these Examples etc. Hereinafter, unless otherwise specified, "parts" and "%" are based on mass.

[0099]

[0100] The molecular weight distribution of the resin composition is measured by GPC and the following measurement conditions by the polystyrene standard method.

[0101] (Measurement conditions of GPC)

[0102] Measuring device: "HLC-8220GPC" manufactured by TOSOH CORPORATION,

[0103] Column: "Shodex KF802" manufactured by Showa Denko Co., Ltd. + "Shodex KF802" manufactured by Showa Denko Co., Ltd. + "ShodexKF803" manufactured by Showa Denko Co., Ltd. + "Shodex KF804" manufactured by Showa Denko Co., Ltd.

[0104] Detector: RI,

[0105] Determination conditions: column temperature 40°C

[0106] Developing solvent Tetrahydrofuran (THF)

[0107] Flow rate 1.0mL / min

[0108] Sample: a substance (5 μL) obtained by filtering a ...

Synthetic example 1

[0137] In the four-necked flask of 1L capacity that thermometer, cooling tube, agitator are installed, drop into 1-naphthol 144g (1.0 mole), methyl isobutyl ketone 400g, water 96g and 92% paraformaldehyde 27.7g (0.85 Moore). Next, 4.8 g of an aqueous solution of p-toluenesulfonic acid adjusted to a concentration of 50% was added to the four-necked flask while stirring. The amount of water in the reaction system was 69.9 parts by mass relative to 100 parts by mass of 1-naphthol. Thereafter, the temperature was raised to 80° C. while stirring the solution in the system, and the reaction was carried out for 2 hours. During the reaction, the organic layer and the water layer will not form a completely compatible "homogeneous" state, but a "heterogeneous" state. After the reaction, the solution in the system was moved to a separatory funnel, and the water layer was separated and removed from the organic layer. Next, after washing with water until the washing water became neutral...

Synthetic example 2

[0139] In a four-neck flask with a capacity of 1 L equipped with a thermometer, a cooling tube, and a stirrer, 144 g (1.0 mole) of 1-naphthol, 2.2 g (0.02 mole) of o-cresol, 400 g of 1-butanol, 96 g of water and 92 % paraformaldehyde 27.7 g (0.85 moles). Next, 4.8 g of an aqueous solution of p-toluenesulfonic acid adjusted to a concentration of 50% was added to the four-necked flask while stirring. The amount of water in the reaction system was 69.9 parts by mass relative to 100 parts by mass of 1-naphthol. Thereafter, the temperature was raised to 80° C. while stirring the solution in the system, and the reaction was carried out for 2 hours. During the reaction, the organic layer and the water layer will not form a completely compatible "homogeneous" state, but a "heterogeneous" state. After the reaction, the solution in the system was moved to a separatory funnel, and the water layer was separated and removed from the organic layer. Next, after washing with water until th...

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Abstract

The purpose of the present invention is to provide: a photosensitive composition which has excellent photosensitivity, resolution, heat resistance and moisture absorption resistance, while being insusceptible to contamination in high temperature environments, and which is suitable as a material for permanent films; and the like. The present invention provides a photosensitive composition for permanent films, which contains a hydroxynaphthalene novolac resin having a structural moiety (I) represented by general formula (1) as a repeating unit and containing a hydroxynaphthalene (A) represented by general formula (2) in an amount of 2% by mass or less in terms of resin solid content, and which does not contain a curing agent, or contains a curing agent in an amount of 50 parts by mass or less per 100 parts by mass of the above-described resin. (In the formulae, R1 represents a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group or a halogen atom, and a plurality of R1 moieties may be the same as or different from each other; R2 represents a hydrogen atom, an alkyl group or an aryl group; and p represents 1 or 2, and q represents 4 or 5, with the sum of p and q being 6).

Description

technical field [0001] The present invention relates to a photosensitive composition, a resist material, and a photosensitive composition having high photosensitivity and resolution, excellent heat resistance and moisture absorption resistance, and being less prone to contamination in a high-temperature environment, which can be used as a permanent film forming material. coating film. Background technique [0002] Compounds containing phenolic hydroxyl groups are used in adhesives, molding materials, coatings, photoresist materials, epoxy resin raw materials, curing agents for epoxy resins, etc. In addition, due to the heat resistance and moisture resistance of cured products etc., so it is widely used in electrical / electronic fields such as semiconductor sealing materials and insulating materials for printed circuit boards as a curable resin composition containing a phenolic hydroxyl group-containing compound itself as a main ingredient, or as a curing agent for epoxy resin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023
CPCC08G8/08C09D161/06G03F7/0236G03F7/004G03F7/0233G03F7/023C08G8/12C08G8/26G03F7/039G03F7/162G03F7/168G03F7/2002G03F7/322
Inventor 今田知之木本诚二佐藤勇介
Owner DIC CORPORATION
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