Manufacturing method of 77Ghz high-precision radio radar printed circuit board

Abstract

The invention discloses a manufacturing method of a 77Ghz high-precision radio radar printed circuit board. The method mainly comprises the steps of line double compensation design, acid etching way selection, optimization design of keeping a rectangular bonding pad and copper-free zone corner in a right angle and optimization design of a sheet electroplating frame. The others are manufactured by adopting a conventional process. The manufacturing method of the 77Ghz high-precision radio radar printed circuit board has the advantages of high pattern-etching precision, small line burrs, high processing efficiency, high yield and the like; the rectangular bonding pad and copper-free zone corner is kept in the right angle; and the cost is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing an automobile radio frequency radar board, in particular to a method for manufacturing a 77Ghz high-precision radio frequency radar printed circuit board. Background technique [0002] The space wave with a frequency of 30-300Ghz is called millimeter wave, which is mainly used in road identification of vehicles and high-voltage line identification of helicopters. The operating frequency bands of automotive millimeter-wave radars are 21.65-26.65Ghz and 76-87Ghz. The more common operating frequencies of automotive millimeter-wave radars are 24Ghz, 77Ghz, and 79Ghz. The application of millimeter-wave radar ranging in automobiles has the characteristics of stable detection performance and good environmental adaptability, because millimeter-wave radar is not easily affected by the shape and color of the object's surface, and is not affected by atmospheric air flow. The impact of rain, snow and fo...

AI Technical Summary

Problems solved by technology

At the same time, the RF radar printed circuit board is made of PTFE+ceramic filler plate. The plate is thin (100-150um) and soft, and the following problems are prone to occur in the processing process: 1. The existing line compensation and etching processing methods cannot effectively ensure the pattern welding. The pad and the corner are at right angles. Due to the flow effect of the etching potion, the four right-angle positions of the pad are easy to etch due to the exchange of etching potion, and become an ellipse of the pad; and the corners of the graphics are difficult to exchange due to the etching potion, forming an ellipse of a copper-free area.

At the same time, the line has large burrs, which greatly affects the transmission quality of the radio frequency signal, making the assembly equipment debugging NG; 2. Using laser engraving copper technology to process, using laser to remove the copper layer in the non-line area, can effectively maintain the graphics accuracy and ensure the right angle of the pad , The requirement of small burrs on the line, but the cost of laser engraving copper equipment is high and the efficiency is low. It takes 2 hours to engrave copper on a copper clad laminate with a size of 450mm×600mm, which cannot be used in mass production for the time being. It is only suitable for small sample production. Long delivery time; 3. The boards selected for the processing of RF radar printed circuit boards are thin (100-150um) and soft, and pits and plated folded plates are prone to appear during the processing. During electroplating, electroplating frames will be used to fix them, assisting copper plating

However, due to the gap between the electroplating frame and the PCB, it is easy to hide the potion, which makes it impossible to dry effectively. The seepage of the potion leads to serious oxidation of the board surface. Discoloration problem occurs, resulting in scrap

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