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A manufacturing method of a flexible circuit board

A technology for flexible circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., and can solve problems such as unstable quality, insufficient precision, and difficulty in mass production. , to achieve the effect of stable line quality, improved adhesion, and improved pool effect

Inactive Publication Date: 2019-01-04
台山市精诚达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing circuits are either not precise enough, or the quality is unstable, making it difficult to achieve mass production

Method used

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  • A manufacturing method of a flexible circuit board
  • A manufacturing method of a flexible circuit board
  • A manufacturing method of a flexible circuit board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Please refer to Figure 1 to Figure 7 , Embodiment 1 of the present invention is:

[0032] A method for manufacturing a flexible circuit board, comprising the steps of:

[0033] Such as figure 1 As shown, firstly, the base material is selected, and the base material includes the first bottom copper layer 1, the PI layer 2 and the second bottom copper layer 3 stacked in sequence, and the first bottom copper layer 1 and the second bottom copper layer 3 have a thickness of 2.9-3.1 μm, and the thickness of the PI layer 2 is 24-26 μm. Preferably, the thicknesses of the first bottom copper layer 1 and the second bottom copper layer 3 are both 3 μm, and the PI layer 2 has a thickness of 25 μm.

[0034] Such as figure 2 As shown, the base material used for making the flexible circuit board is drilled to form a through hole 4 on the base material. The diameter of the through hole 4 is 0.049-0.051 mm, preferably, the diameter of the through hole 4 is 0.05 mm.

[0035] Such...

Embodiment 2

[0042] Embodiment 2 of the present invention is a method for manufacturing a flexible circuit board, which is different from Embodiment 1 in that:

[0043] Both the thickness of the first bottom copper layer and the second bottom copper layer are 3 μm, the thickness of the PI layer is 25 μm, and the diameter of the through hole is 0.05 mm. During super-roughening treatment, the microetching amount of the second copper layer is 1 μm.

[0044] The thickness of the dry film used when pasting the film is 15 μm, and the pressure of the film is 5.5 kg / cm 2 , the speed is 1.2m / min, and the temperature is 90°C.

[0045] The development point of the development is 45%, the speed is 2.9m / min, and the upper spray pressure is 2.0kg / cm 2 , the spray pressure is 1.8kg / cm 2 .

[0046] The etching speed of vacuum etching is 6m / min, and the upper spray pressure is 2.1kg / cm 2 , the spray pressure is 2.0kg / cm 2 .

Embodiment 3

[0048] Embodiment 3 of the present invention is a method for manufacturing a flexible circuit board, which differs from Embodiment 1 in that:

[0049] Both the thickness of the first bottom copper layer and the second bottom copper layer are 2.9 μm, the thickness of the PI layer is 24 μm, and the diameter of the through hole is 0.049 mm. During super-roughening treatment, the microetching amount of the second copper layer is 0.5 μm.

[0050] The dry film thickness that adopts when described sticking film is 14 μ m, and the pressure of described sticking film is 5.4kg / cm 2 , the speed is 1.1m / min, and the temperature is 85°C.

[0051] The development point of the development is 50%, the speed is 3m / min, and the upper spray pressure is 1.9kg / cm 2 , the spray pressure is 1.7kg / cm 2 .

[0052] The etching speed of vacuum etching is 5.5m / min, and the upper spray pressure is 2kg / cm 2 , the spray pressure is 1.9kg / cm 2 .

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Abstract

The invention discloses a manufacturing method of a flexible circuit board. The substrate used for manufacturing the flexible circuit board is drilled so as to form a through hole on the substrate. Carrying out blackening treatment on the drilled substrate so that a toner layer is attached to the hole wall of the through hole; Performing copper plating on the blackened base material to form a first copper layer on the hole wall of the through hole, forming a second copper layer on the surface of the base material, wherein the thickness value of the first copper layer is greater than 8 mum andthe thickness value of the second copper layer is less than 10 mum; The substrate after electroplating copper is subjected to super-coarsening treatment, so that the micro-etching amount of the secondcopper layer is 0.5-1.5 mum; The substrate after the supercoarsening treatment is sequentially subjected to film pasting, exposure, development, vacuum etching and film stripping to obtain the flexible circuit board, and the thickness of the dry film used in the film pasting is 14 to 16 mum. The precision circuit with line width and line distance of 20 [mu] m / 20 [mu] m can be fabricated, and thequality of the circuit is stable, which is suitable for batch production.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a flexible circuit board. Background technique [0002] With the integration of flexible circuit boards, the wide application of wearable products and the development of 5G technology, the development of circuit boards has been promoted to the direction of precision. In order to meet the development needs of the market, increasing the density of lines on the circuit board is a technical problem urgently needed to be solved by the circuit board manufacturing factory. The degree of precision of the circuit on the flexible circuit board mainly depends on the resolution ability of the photosensitive film, the resolution of the exposure machine, and the side etching of the precise circuit. The existing circuits are either not precise enough, or the quality is unstable, making it difficult to achieve mass production. Contents of the invention [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/0502H05K2203/085
Inventor 刘振华苏章泗周辉
Owner 台山市精诚达电路有限公司
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