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A kind of pcb anti-oxidation surface treatment method

A surface treatment and anti-oxidation technology, applied in the secondary treatment of printed circuits, printed circuits, electrical components, etc., can solve the problems of low production efficiency of anti-oxidation production lines, save production costs, improve production efficiency, and ensure production quality. Effect

Active Publication Date: 2019-04-02
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problem of low production efficiency of the existing anti-oxidation production line, and provides a pretreatment method for anti-oxidation surface treatment, and the production efficiency can be improved by applying the existing anti-oxidation production line through the method of the present invention

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] This embodiment provides an anti-oxidation surface treatment method of PCB, and the method is carried out by using an existing anti-oxidation production line. The existing anti-oxidation production line includes 17 cylinders. In the present invention, the cylinders are numbered from front to back according to the running direction of the anti-oxidation production line, namely cylinders 1 to 17. In the anti-oxidation surface treatment method of PCB described in this embodiment, the moving speed of the production board in the anti-oxidation production line is 1.8m / min, and the production board passes through the following processing steps successively:

[0017] a into the board.

[0018] b grinding plate.

[0019] Pressurized water washing in c cylinder body 1: the water temperature is normal temperature, and the water pressure is 1.5-3.5kg / cm2.

[0020] Pressurized water washing in d cylinder block 2: the water temperature is normal temperature, and the water pressure ...

Embodiment 2

[0045] This embodiment provides an anti-oxidation surface treatment method of PCB, which is basically the same as the method described in Embodiment 1, except that the moving speed of the production board in the anti-oxidation production line is 2.25 m / min.

[0046] The method of this embodiment is used to process the production board. After the production board is subjected to the micro-etching treatment of the cylinder body 6, the micro-etching amount on the surface is detected. The micro-etching amount is 1.41 μm, and the micro-etching amount is within the required range of the anti-oxidation production line for the micro-etching amount. (1.0-2.0μm), in line with production requirements. After the production board has undergone the organic solderability and anti-oxidation treatment of the cylinder 14, the thickness of the organic solder protection film on the surface is detected. The thickness of the organic solder protection film is 0.25 μm. The requirements for the thickne...

Embodiment 3

[0048] This embodiment provides an anti-oxidation surface treatment method of PCB, which is basically the same as the method described in Embodiment 1, except that the moving speed of the production board in the anti-oxidation production line is 2.5 m / min.

[0049] The method of this embodiment is used to process the production board. After the production board is subjected to the micro-etching treatment of the cylinder body 6, the micro-etching amount on the surface is detected. The micro-etching amount is 1.35 μm, and the micro-etching amount is within the required range of the anti-oxidation production line for the micro-etching amount. (1.0-2.0μm), in line with production requirements. After the production board has undergone the organic solderability and anti-oxidation treatment of the cylinder 15, the thickness of the organic solder protection film on the surface is detected. The thickness of the organic solder protection film is 0.25 μm. The requirements for the thicknes...

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Abstract

The invention relates to the technical field of circuit board production, in particular to an oxidation-resistant surface treatment method for PCBs. The present invention optimizes the pretreatment process of the anti-oxidation surface treatment, reduces the degreasing step in the prior art, adds one more micro-etching treatment, and moderately increases the speed of the production plate passing through the cylinder body 3 and the cylinder body 6, so that the production plate While passing the production board at a faster speed, the amount of micro-etching can still be guaranteed to be within the range of 1.0-2.0 μm, and when the production board passes through the cylinder 14 at the same speed, the thickness of the organic solder protection film formed on the production board is 0.15 ‑0.35µm range. By applying the method of the invention to the existing anti-oxidation production line, the production quality can be ensured and the production efficiency can be improved, thereby saving the production cost.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to an oxidation-resistant surface treatment method for PCBs. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board. The production of PCB includes two links of circuit design and manufacturing. The manufacture of PCB is based on the previous circuit design. The manufacturing process is generally as follows: according to the design requirements, the inner core board is cut into the required size in the cutting process→inside Lay film on the core board → use the inner layer film to expose in position → develop and remove the uncured film to form an inner layer pattern → etch the copper layer not covered by the film on the inner core board to form an inner layer circuit → fade the film → put The inner core boards are stacked in a certain order and combined by high temperature pressure ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
CPCH05K3/22H05K2203/0766
Inventor 李渊钟宇玲陈勇武张义兵汪广明
Owner JIANGMEN SUNTAK CIRCUIT TECH
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