A kind of preparation method of copper tungsten alloy and cuw-crcu integral material

A technology of copper-tungsten alloy and integral material, which is applied in the preparation of copper-tungsten alloy and the field of CuW-CrCu integral material prepared by copper-tungsten alloy, can solve the problems of high bulk density, high density of CuW alloy, difficult compaction and other problems, and achieve durability Effects of enhanced arc erosion, improved dielectric strength, and improved bonding strength

Inactive Publication Date: 2018-08-03
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

CuW alloys prepared with tungsten powders of different particle sizes have their own advantages and disadvantages: CuW alloys prepared with submicron tungsten powders have high hardness and high electrical conductivity, but the preparation process is extremely cumbersome. The energy is too high and the bulk density is too small, so it is difficult to compact it by conventional cold pressing methods, and it is easy to bring too much impurities in the air during the pressing process, which seriously affects the performance of the alloy.
Micron-sized tungsten powder is easier to handle, and the process of preparing CuW alloy is relatively simple and easy. It is the most widely used and most conventional CuW alloy in electrical contact materials, but its alloy performance is not the best.
The CuW alloy prepared by ultra-micron tungsten powder has high strength, but its matrix has poor continuity and is prone to copper-rich phases, and because of its excessive bulk density, the prepared CuW alloy has a high density, which is difficult to apply in actual production

Method used

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  • A kind of preparation method of copper tungsten alloy and cuw-crcu integral material
  • A kind of preparation method of copper tungsten alloy and cuw-crcu integral material
  • A kind of preparation method of copper tungsten alloy and cuw-crcu integral material

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preparation example Construction

[0025] The preparation method of the copper-tungsten alloy of the present invention is specifically implemented according to the following steps:

[0026] Step 1. Transfer sub-micron tungsten powder, micron tungsten powder, super-micron tungsten powder and induced Cu powder into the mixer, add stainless steel grinding balls, and the ratio of the total mass of the powder to the mass of the stainless steel grinding balls is 1 : 1~5, mixing powder at a speed of 100~200r / min for 4~8h; mass ratio of sub-micron tungsten powder, super-micron tungsten powder, and micron tungsten powder is 1:1:0.5-5, inducing Cu powder The amount of addition is 10% to 15% of the total mass of tungsten powder;

[0027] In step 2, the powder mixed in step 1 is subjected to organic bonding treatment, dried, and sieved with a 200-mesh screen to obtain a mixed powder;

[0028] Step 3. Press the mixed powder obtained in step 2 through a cold pressing die, with a pressing pressure of 300-350KN and holding pressure ...

Embodiment 1

[0037] Step 1. Load the sub-micron tungsten powder, micron tungsten powder, super-micron tungsten powder and induced Cu powder into the blender, and add stainless steel grinding balls. The ratio of the total mass of the powder to the mass of the stainless steel grinding balls is 1: 1. Mix the powder at a speed of 100r / min for 4 hours; the mass ratio of sub-micron tungsten powder, super-micron tungsten powder, and micron tungsten powder is 1:1:0.5, and the amount of Cu powder added is the total mass of tungsten powder 10%;

[0038] In step 2, the powder mixed in step 1 is subjected to organic bonding treatment, dried, and sieved with a 200-mesh screen to obtain a mixed powder;

[0039] Step 3: Press the mixed powder obtained in step 2 through a cold pressing die with a pressing pressure of 300KN and holding the pressure for 40 seconds to form a blank;

[0040] Step 4. Put the blank obtained in step 3 in a high-purity graphite crucible, place a copper block on the blank, and perform s...

Embodiment 2

[0044] Step 1. Load the sub-micron tungsten powder, micron tungsten powder, super-micron tungsten powder and induced Cu powder into the blender, and add stainless steel grinding balls. The ratio of the total mass of the powder to the mass of the stainless steel grinding balls is 1: 2. Mix the powder at a speed of 120r / min for 8 hours; the mass ratio of sub-micron tungsten powder, super-micron tungsten powder, and micron tungsten powder is 1:1:5, and the amount of Cu powder added is the total mass of tungsten powder 12%;

[0045] In step 2, the powder mixed in step 1 is subjected to organic bonding treatment, dried, and sieved with a 200-mesh screen to obtain a mixed powder;

[0046] Step 3. Press the mixed powder obtained in step 2 through a cold pressing die with a pressing pressure of 320KN and holding the pressure for 50 seconds to form a blank;

[0047] Step 4. Put the blank obtained in step 3 in a high-purity graphite crucible, place a copper block on the blank, and perform sin...

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Abstract

The invention discloses a preparation method of a copper-tungsten alloy. After mixing submicron tungsten powder, micron tungsten powder, supermicron tungsten powder and induced Cu powder, they are bonded, dried and sieved to obtain a mixed Powder; the mixed powder is pre-pressed to form a blank, and then the blank is sintered and infiltrated. The CuW alloy and CrCu material prepared above were placed in a high-purity graphite crucible for sintering under a hydrogen protective atmosphere, and then solid solution aging treatment was performed to obtain a CuW-CrCu monolithic material. The present invention prepares CuW alloys with multi-particle sizes by adding different contents of sub-micron and ultra-micron tungsten powders to conventional micron-sized tungsten powders, and the electrical conductivity of the prepared alloys is significantly improved, which is 30% to 50% higher than the national standard . The arc erosion resistance of the CuW alloy prepared under this scheme is enhanced, and its withstand voltage strength is improved; the bonding strength of the prepared CuW‑CrCu monolithic material is significantly improved.

Description

Technical field [0001] The invention belongs to the technical field of alloy material preparation, and specifically relates to a method for preparing a copper-tungsten alloy. The invention also discloses a method for preparing a CuW-CrCu monolithic material from the copper-tungsten alloy prepared by the method. Background technique [0002] Copper tungsten (CuW) electrical contacts are the contact elements of electrical switches, mainly responsible for contacting and disconnecting load current. The safety, reliability, opening and closing characteristics of the switch largely depend on the physical properties of the contact material and its electrical characteristics. CuW series contact materials are widely used in various circuit breakers because of their good arc erosion resistance, welding resistance and high strength. As components of load switches and transformer transfer switches, CuW-CrCu integral contact materials are particularly widely used. [0003] Nowadays, the devel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/04C22C27/04B22F1/00B22F3/10B22F7/08C22F1/18H01H1/04
CPCH01H1/04C22C1/045C22C27/04C22F1/18B22F3/1007B22F3/1035B22F7/08B22F2998/10B22F2999/00B22F1/052B22F2201/013B22F3/02
Inventor 邹军涛王媛媛梁淑华肖鹏杨晓红赵聪
Owner XIAN UNIV OF TECH
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