Copper-based electrical contact composite material and discharge plasma sintering process thereof
A discharge plasma and composite material technology, which is applied in the field of copper-based electrical contact composite materials prepared by ion sintering process, can solve the problems of long sintering time, material performance constraints, low production efficiency, etc., and achieve good arc extinguishing performance, high density, Good wear resistance effect
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Embodiment 1
[0017] The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel-plated), and the rest is copper and other unavoidable impurities.
[0018] According to the composition ratio and preparation process steps, firstly, the rare earth lanthanum and copper are made into copper-lanthanum alloy powder with a lanthanum content of 0.4% and a particle size of 100-400 mesh; Nickel) and copper powder are made into the required ratio and mixed by ball milling. The ball milling time is 3 hours and the speed is 400 rpm. -2040 sintering device for sintering and molding, the initial pressure is 5MPa, the heating rate is 80°C / min, the sintering temperature is 600°C, and the holding time is 6min. Apply a pressure of 50MPa when the highest temperature is reached, release the pressure when the temperature drops to 400°C, and take samples after cooling to 200°C. During the sintering process, keep the vacuum degree in the furnace low...
Embodiment 2
[0021] The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel-plated), and the rest is copper and other unavoidable impurities.
[0022] Ball milling, powder mixing, and spark plasma sintering were carried out according to the same preparation process steps and parameters as in Example 1 according to the proportion of this composition, and the initial pressure was 15 MPa. Through the above process, a copper-based electrical contact composite material is made.
[0023] Basic properties of this material: Density 97.25%; Electrical conductivity 53.25% IACS; Hardness 48 (HB); Oxidation weight gain of 3.40mg / cm2 in 400°C atmospheric environment for 20h 2 .
Embodiment 3
[0025] The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel-plated), and the rest is copper and other unavoidable impurities.
[0026] Ball milling, powder mixing, and spark plasma sintering were carried out according to the same preparation process steps and parameters as in Example 1 according to the proportion of this composition, and the initial pressure was 25 MPa. Through the above process, a copper-based electrical contact composite material is made.
[0027] Basic properties of this material: Density 96.60%; Electrical conductivity 51.00% IACS; Hardness 43 (HB); Oxidation weight gain of 20h at 400°C atmospheric conditions 3.63mg / cm 2 .
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