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Copper-based electrical contact composite material and discharge plasma sintering process thereof

A discharge plasma and composite material technology, which is applied in the field of copper-based electrical contact composite materials prepared by ion sintering process, can solve the problems of long sintering time, material performance constraints, low production efficiency, etc., and achieve good arc extinguishing performance, high density, Good wear resistance effect

Inactive Publication Date: 2016-02-24
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sintering of the above process takes a long time, the production efficiency is low, and the material performance is restricted to a certain extent.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel-plated), and the rest is copper and other unavoidable impurities.

[0018] According to the composition ratio and preparation process steps, firstly, the rare earth lanthanum and copper are made into copper-lanthanum alloy powder with a lanthanum content of 0.4% and a particle size of 100-400 mesh; Nickel) and copper powder are made into the required ratio and mixed by ball milling. The ball milling time is 3 hours and the speed is 400 rpm. -2040 sintering device for sintering and molding, the initial pressure is 5MPa, the heating rate is 80°C / min, the sintering temperature is 600°C, and the holding time is 6min. Apply a pressure of 50MPa when the highest temperature is reached, release the pressure when the temperature drops to 400°C, and take samples after cooling to 200°C. During the sintering process, keep the vacuum degree in the furnace low...

Embodiment 2

[0021] The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel-plated), and the rest is copper and other unavoidable impurities.

[0022] Ball milling, powder mixing, and spark plasma sintering were carried out according to the same preparation process steps and parameters as in Example 1 according to the proportion of this composition, and the initial pressure was 15 MPa. Through the above process, a copper-based electrical contact composite material is made.

[0023] Basic properties of this material: Density 97.25%; Electrical conductivity 53.25% IACS; Hardness 48 (HB); Oxidation weight gain of 3.40mg / cm2 in 400°C atmospheric environment for 20h 2 .

Embodiment 3

[0025] The composition weight ratio of the material in this embodiment is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel-plated), and the rest is copper and other unavoidable impurities.

[0026] Ball milling, powder mixing, and spark plasma sintering were carried out according to the same preparation process steps and parameters as in Example 1 according to the proportion of this composition, and the initial pressure was 25 MPa. Through the above process, a copper-based electrical contact composite material is made.

[0027] Basic properties of this material: Density 96.60%; Electrical conductivity 51.00% IACS; Hardness 43 (HB); Oxidation weight gain of 20h at 400°C atmospheric conditions 3.63mg / cm 2 .

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Abstract

The invention relates to a copper-based electrical contact composite material for middle and low voltage appliance switches, in particular to a method for preparing the copper-based electrical contact composite material through a discharge plasma sintering process. The copper-based composite material is composed of, by weight, 0.5%-4% of bismuth, 0.05%-0.4% of lanthanum, 0.05%-0.3% of a carbon nano tube (nickelized), and the balance copper and unavoidable impurities. The copper-based composite material is prepared through the preparation method of alloy powder preparation, burdening, ball milling and discharge plasma sintering; the discharge plasma sintering process is adopted and has the characteristics of being high in heating speed, short in sintering time, high in density of an obtained material, good in property and the like, so that the discharge plasma sintering process is important to realizing material preparation with high quality, high efficiency, low consumption and low cost. The copper serves as a substrate, so that the main raw material is abundant in resource, and the electrical and thermal conductibility, electric erosive resistance, oxidation resistance and the like of the material are comparable to those of a silver-based electrical contact material, and the essential requirements of electrical contact and the like for the material by workpieces can be met.

Description

technical field [0001] The invention relates to a copper-based electrical contact composite material for medium and low-voltage electrical switches, in particular to a new method for preparing the copper-based electrical contact composite material by adopting a discharge plasma sintering process. Background technique [0002] Weak current contact elements are the key components of instruments and meters, which play an important role in the life and reliability of instruments and meters. In order to ensure the reliability of weak current contacts, precious metal silver and its alloy materials are widely used at home and abroad. In recent years, in order to reduce the loss of silver metal, people are constantly seeking new ways of saving and replacing silver. The electrical and thermal conductivity of copper is the closest to that of silver, so copper is the most suitable element to replace silver as a conductive material, but the main obstacle for copper as an electrical cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/05B22F3/105
CPCB22F3/105C22C1/05C22C9/00
Inventor 肖振耿浩然刘焕超王梦洁
Owner UNIV OF JINAN
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