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Novel high-conductivity silver-free copper alloy material

A silver-copper alloy and high-conductivity technology, which is applied in the field of new materials of high-conductivity silver-free copper alloys, can solve the problem of undensified copper crystal structure, and achieve the effects of compact crystal structure, low resistance and low resistance.

Inactive Publication Date: 2017-01-04
何国良 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (3) The copper crystal structure is not dense

Method used

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  • Novel high-conductivity silver-free copper alloy material

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Effect test

Embodiment 1

[0027] A new material of high-conductivity silver-free copper alloy is composed of the following components by weight: 0.5% manganese, 0.01% cerium, 0.01% lanthanum, 0.002% lithium, and the rest is copper.

Embodiment 2

[0029] A new material of a high-conductivity silver-free copper alloy consisting of the following components by weight:

[0030] 1% manganese, 0.05% cerium, 0.05% lanthanum, 0.005% lithium, and the rest is copper.

Embodiment 3

[0032] A new material of a high-conductivity silver-free copper alloy consisting of the following components by weight:

[0033] 0.7% manganese, 0.03% cerium, 0.03% lanthanum, 0.003% lithium, and the rest is copper.

[0034] Another aspect of the present invention also discloses a method for preparing a high-conductivity silver-free copper alloy, comprising the following steps:

[0035] S1, select electrolytic copper with copper content of 99.99% as copper raw material;

[0036] S2, when the vacuum degree is -1P through the vacuum melting furnace, fill with argon to -0.6 to -0.3P;

[0037] S3, the copper is gradually melted after the moisture and residual gas in the heating furnace and the raw material are released;

[0038] S4, in the molten state of copper at 1150-1200 degrees, add 0.5-1% element manganese, 0.01-0.05% rare earth elements cerium and lanthanum, and 0.002%-0.005% lithium element. and other trace scattered elements, so as to completely remove impurities from ...

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Abstract

The invention discloses a novel high-conductivity silver-free copper alloy material which comprises, in weight percentage, 0.5%-1% of manganese, 0.01%-0.05% of cerium, 0.01%-0.05% of lanthanum, 0.002%-0.005% of lithium and the rest copper. The material has the advantages that the material is low in resistance and high in conductivity and reaches or closes to conductivity of silver. A silver-free copper alloy is a new energy-saving material of copper for electrical engineering and a new essential advanced function material in the field of future military industries and equipment manufacturing industries, and the silver-free copper alloy can replace the silver to use in part fields such as spaceflight, aviation, navigation, submarine and naval ship manufacturing, military equipment light weight, high-end electrical engineering, high-end electric products, energy-saving transformers and motors, wind energy, solar energy, electricity vehicles, new-energy electric vehicles or superconductivity.

Description

technical field [0001] The invention relates to the technical field of copper alloy materials, in particular to a new material of high-conductivity silver-free copper alloy. Background technique [0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. [0003] In the prior art, copper alloy materials have a conductivity between 98% and 99.89%, which severely limits the use of copper for electricians. [0004] The reasons for the low electrical conductivity of copper used in electricians at present: [0005] (1) Smelting under natural conditions makes the content of oxygen and other harmful gas impurities in copper high; [0006] (2) Impurities not higher than 0.005% are allowed to exist in the electrolytic copper and copper wire rods according to the standard stipulated by the state; [0007] (3) The crystal structure of copper is not kept secret. [0008] Therefore, the existing tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/05C22C1/02
CPCC22C9/05C22C1/02
Inventor 何国良
Owner 何国良
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