Solid flux for automatic soldering of soldering tin and preparation method thereof

Abstract

The invention discloses a solid flux for automatic soldering of soldering tin, prepared from the following components by weight percent: 80-86% of deionized water, 4.5-10% of co-solvents, 4-7% of active agents, 0.4-1.2% of nonionic surfactants, 0.9-1.4% of film-forming agents and 0.2-0.4% of corrosion inhibitors. The active agents are prepared from the following components: 0.3-0.7% of 2-hydroxypropanoic acid, 0.7-1.3% of 1,2-ethane dicarboxylic acid, 0.4-0.8% of 1,3-acetone dicarboxylic acid, 0.6-1% of undecanedioic acid, 0.5-0.8% of malonic acid, 1-1.8% of polyethylene glycol PEG-200 and 0.5-1% of succinimide. Compared with the prior art, the solid flux is a water-based flux used for solving problems of no continuous soldering or pinholes of tin soldering of precision circuit boards, has the advantages of good soldering firmness, environmental protection performance and safety, high activity, excellent wettability, low corrosion and low cost, is simple and convenient to prepare, can be operated at room temperature, has low requirements for equipment and has a good application prospect.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a solid flux for automatic soldering and a preparation method thereof. Background technique [0002] The automatic soldering machine is more and more favored by consumers because of its high level of automation, no loss of materials, replacement of manual soldering, soldering at any angle without dead ends, and low power consumption of the equipment. The performance of the flux selected for soldering (also known as soldering) directly affects the efficiency and quality of soldering. At present, when the automatic soldering machine solders delicate electronic products such as circuit boards, the existing fluxes often have low activity and poor wetting effect. When applied to solder wire, there are the following disadvantages: rough appearance of solder joints, small expansion rate, and large wetting angle. , Spreading is not open, it is easy to produce cracks, pinholes, soldering, e...

AI Technical Summary

Problems solved by technology

At present, when the automatic soldering machine solders delicate electronic products such as circuit boards, the existing fluxes often have low activity and poor wetting effect. When applied to solder wire, there are the following disadvantages: rough appearance of solder joints, small expansion rate, and large wetting angle. , Spreading is not open, it is easy to produce cracks, pinholes, soldering, empty soldering, etc., and the soldering is not firm. Poor mechanical and electrical properties, strong corrosion, poor wetting performance, etc.