Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lamination technology of precise circuit board

A circuit board and precision technology, which is applied in the field of precision circuit board lamination technology, can solve the problems of affecting the line width accuracy of the circuit board and large side erosion of the circuit, so as to reduce the amount of side erosion of the circuit, reduce the etching time, and ensure the accuracy. Effect

Active Publication Date: 2016-12-21
JIANGMEN SUNTAK CIRCUIT TECH
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is: the long-time etching of the circuit board causes the side erosion of the circuit to be too large, which affects the accuracy of the line width of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lamination technology of precise circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Before the step S1, browning treatment on the core board and the lower surface is also included. The browning treatment of the core board is to make the combination of the core board and the prepreg stronger.

Embodiment 2

[0030] After a large number of tests and verifications, when the thickness of the browning film (that is, the contour) is 2-4 microns, the tensile force between the copper foil and the prepreg can be guaranteed to be above 4lb / inch, and a firm bonding effect between the copper foil and the prepreg can be achieved. .

Embodiment 3

[0032] In the step S2, the rough side of the copper foil faces outward, and the smooth side faces the prepreg. The profile of the smooth surface of the copper foil after browning (2-4 microns) is smaller than the profile of the rough surface of the copper foil (8-10 microns), so it can effectively reduce the depth of the copper foil entering the prepreg, making the circuit board easier to etch. The etching time is relatively reduced, and the side etching amount of the circuit is also relatively reduced, thereby ensuring the accuracy of the line width of the circuit board.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a lamination technology of a precise circuit board. Brown oxidation is carried out on the smooth surface of a copper foil, the copper foil is laminated with a core plate with the smooth surface facing a prepreg, and a rough surface copper foil at the external layer of the circuit board is polished to obtain a flat copper surface. The lamination technology has the advantages that the etching time of the circuit board is reduced, the etching amount of the circuit side is reduced, and the line width precision of the circuit board is ensured.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a pressing process of a precision circuit board. Background technique [0002] The past lamination process of multilayer printed circuit boards is: [0003] Core board browning-board arrangement (core board, prepreg, copper foil laminated together)-pressing-cutting. [0004] Among them, the copper foil splitting surface and the rough surface (also known as the rough surface), the rough surface is the copper foil after electrolysis after tumor treatment, yellowing treatment and anti-oxidation treatment, presenting a convex-convex crystal structure, contour (roughness) Generally 8-10 microns. [0005] During the lamination process, the rough surface of the copper foil and the prepreg are bonded together. The core board processed by this method has a deep profile of the rough surface of the copper foil, and the embedding of the prepreg is relatively deep, which ma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/46H05K3/38
CPCH05K3/385H05K3/4652H05K2203/0307
Inventor 杨林钟宇玲敖四超寻瑞平
Owner JIANGMEN SUNTAK CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com