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Thermosetting resin composition and prepreg made of thermosetting resin composition, as well as laminated board

A technology of resin composition and prepreg, applied in synthetic resin layered products, lamination, lamination devices, etc., can solve the problems of poor adhesion, low heat resistance, damage to the dielectric properties of the system, etc.

Active Publication Date: 2016-12-14
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. However, there are still many problems to be solved in practical applications such as low transition temperature and poor adhesion.
For example, in the Chinese invention patent CN10544841B, a combination of hydrocarbon resin and allyl-modified phenolic resin is used to make printed circuit boards. Although the adhesive performance of the resin is improved, the peel strength of the board is improved, but it is still low. And the heat resistance of the system is low
Chinese patent CN104845363A uses hydrocarbon resin, allyl-modified benzoxazine resin and allyl-modified bismaleimide resin composition to make printed circuit boards, which improves heat resistance and peel strength , but because allyl-modified benzoxazine resin and allyl-modified bismaleimide resin will introduce a large number of hydroxyl groups, which will damage the dielectric properties of the system

Method used

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  • Thermosetting resin composition and prepreg made of thermosetting resin composition, as well as laminated board
  • Thermosetting resin composition and prepreg made of thermosetting resin composition, as well as laminated board

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0057] Put N-(4-hydroxyphenyl)maleimide (190g, 1mol), phenol (94g, 1mol, M94) and oxalic acid (10g) into the flask equipped with thermometer, condenser and stirrer, mix and stir After uniformity, put it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (150mL, the ratio of phenol / aldehyde to 1 / 0.8) dropwise into the flask for 0.5 hours; after adding formaldehyde, maintain 70°C The temperature and stirring conditions were reacted for 15 hours; then, the reaction product was dissolved and diluted with 400mL acetone, and then the reaction product was precipitated with 40% methanol aqueous solution; the above dissolution-precipitation operation was repeated 3 to 5 times, and it was filtered, separated, Drying yielded pure maleimide phenolic formaldehyde (P-1).

[0058] Take 100g of maleimide phenolic novolac (P-1) prepared by the above method and 500g of methyl isobutyl ketone solvent and put them in a flask to fully mix and dissolve, de...

Synthetic example 2

[0061] With reference to the method of synthetic example 1, the maleimide ester (B-2) of following structure is obtained:

[0062] ; Among them, Ar is , R is phenyl;

[0063] Among them, n is 1~10, and the ratio of x to y is 0.5:1.

Synthetic example 3

[0065] With reference to the method for synthetic example 1, the maleimide ester (B-3) of following structure is obtained:

[0066] ; Among them, Ar is: , R is maleimidophenyl;

[0067] Among them, n is 1~10, and the ratio of x to y is 0.1:1.

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Abstract

The invention discloses a thermosetting resin composition which is prepared from the following components based on the weight of solids: (a) 10 to 100 parts of hydrcarbon resin, (b) 20 to 100 parts of maleimide ester, and (c) 0.1 to 8 parts of an initiator. According to the thermosetting resin composition, the maleimide ester with a polyfunctional long chain structure and a rigid imide ring works together with the flexible hydrcarbon resin to form a thermosetting composition, and the maleimide ester and the rigid imide ring react with each other, so that finally the thermosetting resin composition and a prepreg made of the thermosetting resin composition as well as a laminated board have the characteristics of excellent dielectric property, heat resistance, adhesion property, flame retardancy, bending strength and toughness, high peeling strength, low water absorption rate, excellent processing property and the like.

Description

technical field [0001] The invention relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition, and belongs to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/34C08L47/00B32B37/06B32B37/10B32B15/04B32B27/18
CPCB32B15/04B32B27/18B32B37/06B32B37/10B32B2457/08C08L47/00C08L61/34C08L2201/08C08L2203/20C08L2205/03
Inventor 何继亮崔春梅马建肖升高陈诚罗鹏辉易强储正振
Owner SHENGYI TECH SUZHOU
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