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A packaging structure and packaging method for improving the mechanical strength of frit packaging

An encapsulation method and encapsulation layer technology, which are applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of fragile fracture, inability to effectively release glass extrusion stress and impact stress, etc., to improve adhesion force, reducing laser power, increasing the effect of weld strength

Active Publication Date: 2019-12-13
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, in order to solve the problem that the display body cannot effectively release the extrusion stress and impact stress on the glass when it is squeezed or impacted from the front, resulting in a fragile phenomenon, the present invention provides a method for improving the mechanical strength of the Frit package. Encapsulation structure and encapsulation method thereof

Method used

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  • A packaging structure and packaging method for improving the mechanical strength of frit packaging
  • A packaging structure and packaging method for improving the mechanical strength of frit packaging
  • A packaging structure and packaging method for improving the mechanical strength of frit packaging

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Embodiment 1

[0033] Such as figure 1 Shown, make metal film layer 4 on substrate 5, prepare inorganic quantum dot nano film layer 3 on cover glass 1, then prepare Frit encapsulation layer 2 on inorganic quantum dot nano film layer 3, metal on substrate 5 The film layer 4 is docked with the Frit encapsulation layer 2 on the cover glass 1 , and the cover glass 1 and the substrate 5 are welded and sealed by light irradiation. Preferably, the encapsulation area of ​​the cover glass 1 and the substrate 5 is sealed by laser welding.

[0034] Wherein the thickness of the prepared inorganic quantum dot nano film layer 3 is 100nm~1000nm, the thickness of the prepared Frit encapsulation layer 2 is 4~6 μ m; the preferred inorganic quantum dot nano film layer 3 thickness is 800nm, the preferred Frit encapsulation layer 2 The thickness is 5 μm.

[0035] The method for preparing the inorganic quantum dot nano film layer includes one of a vapor phase deposition method, a 3D printing method, an inkjet p...

Embodiment 2

[0040] Such as figure 2Shown, different from embodiment 1 is: make metal film layer 4 on substrate 5, on cover glass 1 first prepare Frit encapsulation layer 2, then prepare inorganic quantum dot nano film layer 3 on Frit encapsulation layer 2, Then the metal film layer 4 on the substrate 5 is docked with the inorganic quantum dot nano film layer 3 on the cover glass 1, and the cover glass 1 and the substrate 5 are fused and sealed by light source irradiation, so that figure 2 structure shown. Preferably, the encapsulation area of ​​the cover glass 1 and the substrate 5 is sealed by laser welding.

[0041] The thickness of the prepared inorganic quantum dot nano film layer 3 is 500nm~2000nm, the thickness of the prepared Frit encapsulation layer 2 is 4~6 μ m, the preferred inorganic quantum dot nano film layer 3 thickness is 1000nm, the preferred Frit encapsulation layer 2 The thickness is 5 μm.

[0042] In the above two embodiments, the inorganic quantum dot nano-film la...

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Abstract

The invention discloses an encapsulating structure and method for improving Frit encapsulating mechanical strength. A metal film layer is made on a substrate; a Frit encapsulating layer and inorganic quantum dot nano-film layers are prepared on an encapsulating area of cover plate glass; the cover plate glass and an encapsulating area of the substrate are subjected to butt joint; a light source is used for illuminating the cover plate glass and the encapsulating area of the substrate, and the cover plate glass and the substrate are welded and sealed. According to the encapsulating structure and method for improving the Frit encapsulating mechanical strength, the Frit encapsulating strength is enhanced through the inorganic quantum dot nano-film layers, the fused Frit encapsulating layer can permeate into gaps of the nano-film layers, a glass material and nano-film layer composite enhancing system is formed, the welding strength is improved, and the adhesion of the Frit encapsulating layer and the cover plate glass is improved; meanwhile, the uniform and compact film layers formed by the inorganic quantum dot nano-film layers can perform the action of a buffer layer and the action of releasing stress when the cover plate glass is extruded; absorption of lasers can be increased through quantum dots, a smaller laser welding Frit encapsulating layer can be adopted, and the thermal stress impact of a screen body is reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure and a packaging method for improving the mechanical strength of Frit packaging. Background technique [0002] Currently, there are two types of display screens, Frit (glass frit) package and film package. Frit packaging prints glass frit on the cover glass, and uses laser beam to move and heat the frit to melt to form an airtight package. The frit is melted on the glass substrate to form a sealing body. The disadvantage of this packaging method is that the adhesion between the glass frit and the surface of the cover plate is insufficient, and it cannot provide sufficient mechanical strength; at the same time, because the strength of the place where the two pieces of glass are in contact is not strong enough, it is easy to break when it is squeezed and impacted. question. [0003] Chinese patent document CN 103102075 discloses a method and device for seali...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L21/56
CPCH01L21/56H01L23/291H01L23/298
Inventor 李春霞李伟丽甘帅燕吴伟力彭兆基
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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