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Heat pump device

A heat pump device and heat transfer technology, applied in household refrigeration devices, refrigeration device isolation, pumps, etc., can solve problems such as productivity deterioration, slow curing speed, mold corrosion, etc., and achieve the effect of inhibiting decomposition reactions

Active Publication Date: 2016-11-23
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] However, there are the following problems: during melt molding, the solidification rate is slow, thereby incurring a deterioration in productivity; burrs are easily generated; and the mold is corroded due to the generation of sulfur gas due to slight decomposition.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0058] figure 1 and figure 2 The heat pump device according to Embodiment 1 of the present invention will be described. figure 1 To show the basic structure of the refrigerant circuit diagram, figure 2 It is a sectional view showing a side view of a part (compressor). It should be noted that each figure is schematically depicted, and the present invention is not limited to the depicted manner.

[0059] (Refrigerant cycle)

[0060] in figure 1 In the heat pump device 100, a compressor 1 for compressing the refrigerant, a condenser 3 for condensing the refrigerant flowing from the compressor, a throttling mechanism 4 for adiabatic expansion of the refrigerant flowing from the condenser 3, The evaporator 5 that evaporates the refrigerant flowing out of the flow mechanism 4, and the refrigerant pipe 2 that connects these in order to circulate the refrigerant. It should be noted that the refrigerant pipe 2 may be provided with a switching valve (for example, a four-way valve) for ch...

Embodiment approach 2

[0107] Figure 4 The heat pump device according to the second embodiment of the present invention is described. It shows trans-1,1,2-trifluoroethylene (R1123(E)), mixing ratio, and mixture ratio of ethylene-based hydrogen fluoride refrigerant mixed with R32 at 250°C. The pressure-weight ratio correlation diagram of the range where the disproportionation reaction occurs when the pressure is changed. In the heat pump device according to the second embodiment of the present invention, the refrigerant circuit, the compressor, the electric motor, and the refrigerating machine oil have the same configuration as in the first embodiment, except that the configuration of the refrigerant is changed.

[0108] by Figure 4 It is understood that as the mixing ratio of R1123(E) increases, and as the pressure increases, the disproportionation reaction tends to occur easily.

[0109] In the heat pump device of Embodiment 2, the refrigerant pressure is 6 MPa even at the maximum. In the pressure ...

Embodiment approach 3

[0112] The refrigerant used in the third embodiment is a monomer composed of either propylene-based fluorinated hydrocarbon (HFO-1234yf) or ethylene-based hydrogen fluoride; or a composite composed of two or more types; or, containing difluoromethane ( A composite of a mixture of HFC-32) and ethylene-based hydrogen fluoride has a ratio of ethylene-based hydrogen fluoride to R32 of 70% by weight or less.

[0113] The ethylene-based hydrogen fluoride is trans-1,2-difluoroethylene (R1132(E)), fluoroethylene (R1141), cis-1,2-difluoroethylene (R1132(Z)), 1,1-difluoroethylene (R1132(Z)) Either of fluoroethylene (R1132a) and 1,1,2-trifluoroethylene (R1123), one or more of them may be mixed.

[0114] Propylene-based fluorinated hydrocarbons and ethylene-based hydrogen fluoride refrigerants are thermally and chemically unstable, and are prone to decomposition and polymerization caused by chemical reactions. Especially in the high temperature part, the chemical reaction of the refrigerant i...

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Abstract

Provided is a heat pump device achieving long term reliability by using an insulating material that is not readily hydrolyzed. An electric motor (6) of a compressor (1) comprises a stator (6s) that is fixed to a sealed container (10) and on which a winding wire (6w) is wound with an insulating material (7) therebetween, and a rotor (6r) that is surrounded by the stator (6s). The insulating material (7) is a wholly aromatic liquid-crystal polyester (LCP) in which a main molecular chain is formed by bonding by ester bonds a monomer of para-hydroxybenzoate (PHB) as an essential component and another monomer of just ingredients having a benzene ring, and the saturated water content for the refrigeration oil is 2% or lower in 80% relative humidity at 40DEG C for 24 hours. That is, a chemical species that supplements active radicals that cause the decomposition reaction is generated by using a flame retardant in order to suppress the explosive decomposition reaction of an ethylene-based fluorohydrocarbon.

Description

Technical field [0001] The present invention relates to a heat pump device, and more particularly, to a heat pump device including a compressor including a hermetic container accommodating an electric motor to form a refrigeration cycle. Background technique [0002] Heretofore, as heat pump devices, there are compressors, condensers, throttling mechanisms, and evaporators that compress refrigerants in sequence to perform a refrigeration cycle, and the condenser or evaporator uses the heat or cold heat of the refrigerant. A heat pump device delivered to the heat medium (for heat transfer). [0003] The compressor is equipped with a compression mechanism and an electric motor that drives the compression mechanism to rotate. They are housed in an airtight container. The high-pressure and high-temperature refrigerant compressed by the compression mechanism is temporarily discharged into the airtight container, so the electric motor is exposed to the high-pressure and high-temperature ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B31/02F04B39/00F04C29/00F25B1/00
CPCF04B39/00F04C29/00F25B31/02F25B1/04F25B31/002F25B2400/121F25B2500/11F25B2400/07F04C18/356F04C29/0085F04C29/02F04C2210/263F04C2240/30F04C2240/40F25B13/00F25D23/065F25D23/08F25D2201/10
Inventor 松永训明小笠原忍景山岳春外山悟水野康太平川宽
Owner MITSUBISHI ELECTRIC CORP
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