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Polyimide film with low thermal expansion coefficient and preparation method thereof

A polyimide film and thermal expansion coefficient technology, applied in the field of polyimide film and its preparation, can solve the problems of high thermal expansion coefficient and low thermal expansion coefficient, achieve low thermal expansion coefficient, high strength modulus, improve chemical and The effect of dimensional stability

Inactive Publication Date: 2016-10-12
安徽统唯新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is in order to solve the high defect of polyimide film thermal expansion coefficient in the prior art, provide a kind of polyimide film and preparation method thereof with low thermal expansion coefficient to solve the above problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Step 1: According to the mass percentage, add 75.1% of dimethylacetamide and 9.5% of diaminodiphenyl ether into the reactor, stir for 55 minutes, then add 10.4% of pyromellitic dianhydride into the reactor, and stir 55min, and finally add 5% zinc oxide whiskers with a length of 4μm into the reactor, and stir for 55min. After the stirring is completed, the glue is prepared. The temperature in the reactor is 23°C, and the pressure in the reactor is 0.2MPa;

[0019] Step 2: The glue solution is salivated onto the surface of the mirror steel belt of the casting machine through the spraying die, and the glue solution is prepared into a gel film by the casting machine under the condition of 180°C;

[0020] Step 3: Peel the gel film from the surface of the mirror steel belt of the casting machine. Under the condition of 500°C, first use a longitudinal stretching machine to stretch the gel film longitudinally, and the stretching ratio of the longitudinal stretching is 1.2 , and...

Embodiment 2

[0022] Step 1: According to the mass percentage, add 76.1% of dimethylacetamide and 9.5% of diaminodiphenyl ether into the reactor, stir for 45 minutes, then add 10.4% of pyromellitic dianhydride into the reactor, and stir 45min, finally add 4% of zinc oxide whiskers with a length of 2μm into the reactor, and stir for 45min. After the stirring is completed, the glue is prepared. The temperature in the reactor is 24°C, and the pressure in the reactor is 0.1MPa;

[0023] Step 2: The glue solution is salivated onto the surface of the mirror steel belt of the casting machine through the spraying die, and the glue solution is prepared into a gel film by the casting machine under the condition of 160°C;

[0024] Step 3: Peel off the gel film from the surface of the mirror steel belt of the casting machine. Under the condition of 400°C, use a longitudinal stretching machine to stretch the gel film longitudinally. The stretching ratio of the longitudinal stretching is 1.2 , and then u...

Embodiment 3

[0026] Step 1: According to the mass percentage, add 79.1% of dimethylacetamide and 9.5% of diaminodiphenyl ether into the reactor, stir for 35 minutes, then add 10.4% of pyromellitic dianhydride into the reactor, and stir 35min, finally add 1% zinc oxide whiskers with a length of 1μm into the reactor, stir for 35min, and prepare the glue after the stirring is completed, the temperature in the reactor is 24°C, and the pressure in the reactor is 0.1MPa;

[0027] Step 2: The glue solution is salivated onto the surface of the mirror steel belt of the casting machine through the spraying die, and the glue solution is prepared into a gel film by the casting machine under the condition of 160°C;

[0028] Step 3: Peel the gel film from the surface of the mirror steel belt of the casting machine. Under the condition of 450°C, first use a longitudinal stretching machine to stretch the gel film longitudinally, and the stretch ratio of the longitudinal stretching is 1.2 , and then use a ...

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PUM

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Abstract

The invention discloses a polyimide film with low thermal expansion coefficient and a preparation method thereof; the polyimide film comprises the following components by the mass percentage: 7%-17% of 1,2,4,5-benzenetetracarboxylic dianhydride, 4%-12% of diaminodiphenyl ether, 70%-88% of dimethylacetamide and 1%-9% of zinc oxide crystal whiskers. The preparation method comprises the steps: adding dimethylacetamide and diaminodiphenyl ether into a reaction kettle, stirring for 25 min-55 min, adding 1,2,4,5-benzenetetracarboxylic dianhydride into the reaction kettle, stirring for 25 min-55 min, finally, adding the zinc oxide crystal whiskers into the reaction kettle, stirring for 25 min-55 min, and thus obtaining a glue liquid after the stirring is completed; making the glue liquid into a gel film by a casting machine; and peeling the gel film from the surface of a mirror steel band of the casting machine, firstly, longitudinally stretching the gel film by using a longitudinal stretching machine, then transversely stretching the gel film by using a transverse stretching machine, and thus obtaining the polyimide film. The polyimide film has the advantages of low thermal expansion coefficient and the like.

Description

technical field [0001] The invention relates to the field of polyimide film production and processing, in particular to a polyimide film with low thermal expansion coefficient and a preparation method thereof. Background technique [0002] Polyimide film has excellent thermal stability, chemical corrosion resistance and mechanical properties, usually orange, graphite or glass fiber reinforced polyimide has a flexural strength of 345 MPa and a flexural modulus of 20GPa Among them, polyimide films are widely used in aerospace, electrical, mechanical, microelectronics, chemical industry and other fields, but the thermal expansion coefficient of existing polyimide films is relatively high, so polyimide films are not suitable for In some special fields, it is necessary to make further improvements to the existing polyimide films. Contents of the invention [0003] The object of the present invention is to solve the defect of high thermal expansion coefficient of the polyimide ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K7/08C08J5/18C08G73/10
CPCC08K7/08C08G73/1007C08G73/1071C08J5/18C08J2379/08C08K2201/004C08L2201/08C08L2203/16C08L2312/00
Inventor 王超吴小杰
Owner 安徽统唯新材料科技股份有限公司
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