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Method and apparatus for a directly electrically heated flow-through chemical reactor

A chemical reaction and chemical technology, applied in chemical instruments and methods, chemical/physical/physicochemical fixed reactors, separation methods, etc., can solve problems such as poor chemical tolerance, uneven heat dispersion, and chemical substance operation , to achieve the effects of improving chemical resistance, eliminating dead volume, and uniform heat distribution

Inactive Publication Date: 2016-10-05
MKS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] One problem with the system 100 is that the tube 120 may need to be welded or otherwise manipulated (e.g., bent), causing heat to spread unevenly through the chemical
Additionally, some portions of the tube 120 may have undesired condensation buildup and dead spots, further resulting in uneven heat distribution
[0009] Existing methods may also take longer than necessary to heat up due to, for example, additional heat resistance due to the presence of the heating element
Existing methods and devices can be very expensive, large and / or heavy due to, for example, the size, cost and / or weight of the heating element
[0010] Another problem is that existing thermal reactors often do not have good chemical resistance and / or cannot operate against a wide range of chemicals because, for example, the heating elements are not resistant to highly corrosive chemicals
Poor chemical resistance can lead to premature corrosion of the reactor
[0011] Another problem with existing methods is that the conversion of ozone from ozone gas to oxygen in ozonolysis may be less than 95%

Method used

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  • Method and apparatus for a directly electrically heated flow-through chemical reactor
  • Method and apparatus for a directly electrically heated flow-through chemical reactor
  • Method and apparatus for a directly electrically heated flow-through chemical reactor

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Embodiment Construction

[0031] The invention generally involves the direct connection of an electrically conductive component, such as a metal pipe, to a power source. The conductive component is capable of holding the chemical mixture inside. The power supply applies power to the conductive component. The conductive component is heated by the applied power. The electrically conductive component has an interior region through which a chemical mixture can circulate.

[0032] When the chemical mixture is placed into the interior region of the conductive component and power is applied, heat generated in the conductive component is transferred to the chemical mixture, causing the chemical mixture to be heated. A portion of the conductive component can be cooled. The cooled portion of the conductive component is capable of cooling the chemical mixture flowing through the conductive component. In one embodiment, after the chemical mixture has been heated, the chemical mixture can be cooled.

[0033] T...

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Abstract

A system and method for facilitating a chemical reaction is provided. The system can have an electrically conductive member. The electrically conductive member is capable of holding a chemical mixture. The electrically conductive member is directly coupled to a power source and is heated when the power source is on. When a chemical mixture is within the electrically conductive member and the power source is on, the chemical mixture is heated such that a chemical reaction can occur.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Patent Application No. 14 / 189,649, filed February 25, 2014, and U.S. Provisional Patent Application No. 61 / 956,189, filed February 14, 2014, each of which is an assignee of this application All, whose original text is incorporated herein by reference. field of invention [0003] The present invention generally relates to apparatus, systems and methods for chemical vapor deposition (CVD) and wet wafer processing applications. In particular, the present invention relates to heating a conductive component by directly connecting it to a power source to cause a chemical reaction of one or more chemicals placed in the conductive component. Background technique [0004] In the manufacture of semiconductor devices, various chemicals are used. Chemicals are used to etch wafers, clean chambers, and a host of other operations that occur during semiconductor device fabrication. [0005] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J19/24B01D53/66
CPCB01D53/66B01J19/2415B01J19/243B01D2257/106B01D2257/2066B01D2258/0216B01J2219/0277B01J2219/0286B01J2219/00132B01J2219/00135B01J2219/00159A62D3/40F23G5/10C01B13/0203B01J19/0013C01B13/02
Inventor J·塞沃特C·戈茨查克J·洛尔M·布拉查
Owner MKS INSTR INC
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