Light-emitting diode (LED), LED packaging method, straight down type backlight module and liquid crystal display television
A direct-type, encapsulating adhesive technology, applied in optics, circuits, electrical components, etc., can solve the problems affecting the chromaticity consistency and chromaticity non-uniformity of direct-type backlight modules.
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[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] In the present invention, by improving the packaging structure of the LED, that is, two layers of different substances are packaged on the surface of the blue chip, so that the chromaticity of the LED itself becomes uniform, thereby solving the problem of inconsistency in the chromaticity of the direct-type backlight module.
[0031] T...
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