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Manufacturing method of composite lightweight flexible high thermal conduction carbon/metal connection member

A metal composite, high thermal conductivity technology, applied in the direction of modification by conduction and heat transfer, cooling/ventilation/heating transformation, etc., can solve the problems of high thermal conductivity, large difference in thermal expansion coefficient, and large interface thermal resistance of carbon materials. Achieve strong designability, reduce interface thermal resistance, and small interface thermal resistance.

Active Publication Date: 2016-08-10
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Due to the poor wettability of carbon materials and metal aluminum or copper, it is difficult to be closely combined, and the thermal expansion coefficients of the two are also quite different, and they are easy to separate from each other in the process of heating and cooling, resulting in a large interface thermal resistance, which seriously hinders carbon materials. The use of high thermal conductivity of materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Due to the poor wettability of carbon materials and metal aluminum or copper, it is difficult to be closely combined, and the thermal expansion coefficients of the two are also quite different, and they are easy to separate from each other in the process of heating and cooling, resulting in a large interface thermal resistance, which seriously hinders carbon materials. The material has high thermal conductivity to play. Therefore the present invention at first to high thermal conductivity mesophase pitch-based carbon fiber bundle (thermal conductivity at room temperature is 800W.m -1 .K -1 , with a diameter of 10μm and a density of 2.2g / cm 3 ) at both ends (about 2cm at each end, can be adjusted as needed) for surface treatment (such as cleaning), and then electroless nickel plating for these two ends, and the thickness of the nickel plating layer is controlled at about 0.5μm; the carbon fiber bundle The nickel-plated part is placed in the mold in one direction, and t...

Embodiment 2

[0026] The high thermal conductivity carbon fiber in embodiment 1 is changed into high thermal conductivity carbon film (thickness is 25 μ m, thermal conductivity is 1500W.m -1 .K -1 , with a density of 2.2g / cm 3 ), first surface treatment and electroless nickel plating were carried out on its two ends and the thickness of the coating was controlled to be 0.5 μm, and then placed in a mold for pouring treatment of pure aluminum. Other preparation conditions were the same as in Example 1. In this example, carbon The number of layers and the width of the film stack are determined by the heat transfer performance of the flexible, highly thermally conductive coupling. Its heat conduction efficiency is 2.5 times that of copper heat conduction cables under the same conditions, and its weight is only 1 / 4 of that of copper.

Embodiment 3

[0028] After surface treatment of the high thermal conductivity carbon fiber in Example 1, use it as the anode, place 2 cm at both ends in the nickel salt solution, and use the carbon plate placed in the solution as the cathode, connect the two ends, and apply a certain voltage , plate metal nickel on the surface of the carbon fiber, control the thickness of the coating to 0.5 μm by adjusting the electroplating process conditions, then place the two ends of the treated carbon fiber in a mold in one direction to carry out the pouring treatment of pure aluminum, other preparation conditions are the same as in Example 1 Similarly, the number of carbon fiber bundles in this embodiment is determined according to the heat transfer power. Its heat conduction efficiency is twice that of copper heat conduction cables under the same conditions, and its weight is only 1 / 4 of that of copper.

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Abstract

The invention relates to a manufacturing method of a composite lightweight flexible high thermal conduction carbon / metal connection member and belongs to the technical field of connection members. According to the method, firstly, surface treatment on brightness of a carbon material is carried out, one or more layers of metal is plated on the surface in a chemical or an electroplating mode, the treated carbon material and the metal are composited, the composition effect of the carbon / metal is greatly reinforced, and the interface thermal resistance between the two can be effectively reduced. According to the method, the manufactured composite lightweight flexible high thermal conduction carbon / metal connection member has higher thermal conduction coefficient than copper, and density is only one quarter of the copper. Through the method, requirements of weight reduction and efficient thermal conduction of the aerospace field and portable electronic devices can be satisfied; as the connection member is flexible, the distance and the position between the electronic device and a heat sink can be flexibly designed and adjusted, and strong designability is realized.

Description

technical field [0001] The invention relates to a preparation method of a light-weight flexible carbon / metal composite high-thermal-conduction joint, which belongs to the technical field of joints. Background technique [0002] With the rapid development of aerospace technology and the continuous improvement of people's quality of life, aerospace electronic equipment and portable mobile electronic equipment are required to have higher and higher performance, smaller and smaller volumes, and more and more complex functions. Integrated electronic devices are getting denser, consuming more power and generating more heat. It will cause the device to heat up and heat up, and if the temperature is too high, it will shorten its life and even burn it out. Therefore, these heat must be directed and exported in time. [0003] Due to the special environment of aerospace electronic equipment and portable mobile electronic equipment and the special requirements for portable miniaturiza...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 马兆昆宋怀河索勋肖萌
Owner BEIJING UNIV OF CHEM TECH
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