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Ceramic metal composite substrate and production method thereof

A composite substrate and ceramic metal technology, which is applied in the field of ceramic metal composite substrate and its preparation technology, achieves the effects of simple production process, reduced thermal resistance and low expansion coefficient

Active Publication Date: 2016-08-03
SHANTOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a ceramic-metal composite substrate and its preparation process to solve the current problems of small, light and thin development and better thermal conductivity.

Method used

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  • Ceramic metal composite substrate and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A ceramic aluminum metal composite substrate, the specific preparation process is:

[0034] (1) First weigh the alumina ceramic powder according to the volume ratio of micron powder and nano powder as 85:15, and mix evenly; then add solvent, dispersant, plasticizer, and binder to the ceramic powder in sequence , film-forming agent, defoaming agent and other ball mills to prepare casting slurry, the mass of ceramic powder in the casting slurry accounts for 65%; then the casting raw tape is prepared by casting molding process, and finally dried, degummed, and sintered to prepare a thickness of 0.05mm ultra-thin ceramic sheet 1;

[0035] (2) Surface treatment is performed on the aluminum metal substrate 3 with a thickness of 1 mm to obtain a surface with a certain roughness or texture, and the surface is cleaned and dried;

[0036] (3) Then use the coating process to coat the thermally conductive adhesive 2 containing 20% ​​carbon fiber (length-to-diameter ratio: 12~26) o...

Embodiment 2

[0040] A ceramic aluminum alloy composite substrate, the specific preparation process is:

[0041] (1) First weigh the cordierite ceramic powder according to the volume ratio of micron powder and nano powder as 80:20, and mix evenly; then add solvent, dispersant, plasticizer, and binder to the ceramic powder in sequence , film-forming agent, defoaming agent and other ball mills to prepare casting slurry, the quality of ceramic powder in the casting slurry accounts for 68%; then adopt the casting molding process to prepare the casting raw tape, and finally dry, degumming, and sintering to prepare a thickness of 0.5mm ultra-thin ceramic sheet 1;

[0042] (2) Surface treatment is performed on the aluminum alloy substrate 3 with a thickness of 2 mm to obtain a surface with a certain roughness or texture, and the surface is cleaned and dried;

[0043] (3) Apply the thermally conductive adhesive 2 containing 25% aluminum nitride whiskers (with an aspect ratio of 12~20) on the metal...

Embodiment 3

[0047]A ceramic copper metal composite substrate, the specific preparation process is:

[0048] (1) First weigh the ceramic powder according to 75% alumina micron powder and 25% aluminum nitride nano powder (volume ratio), mix evenly; then add solvent, dispersant, plasticizer to the ceramic powder in sequence Casting slurry is prepared by ball milling of additives, binders, film-forming agents, defoaming agents, etc., and the mass of ceramic powder in the casting slurry accounts for 70%; then tape-casting tapes are prepared by tape-casting molding technology, and finally dried, degummed, Sintering to prepare an ultra-thin ceramic sheet 1 with a thickness of 1 mm;

[0049] (2) Surface treatment is performed on the copper metal substrate 3 with a thickness of 1 mm to obtain a surface with a certain roughness or texture, and the surface is cleaned and dried;

[0050] (3) Then apply the thermally conductive adhesive 2 containing 30% Cu fibers (length-to-diameter ratio: 12-20) by ...

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Abstract

The invention relates to a ceramic metal composite substrate and a production method thereof. The substrate mainly comprises an ultrathin ceramic sheet, a heat conduction glue and a metal substrate; the ceramic powder of the ultrathin ceramic sheet is a micropowder and a nanopowder mixture, and the volume proportion of nanopowder in the ceramic powder is 15-25%; and the heat conduction glue comprises, by volume, 20-30% of a one-dimensional high heat conduction material. The production method mainly comprises the following steps: making the ultrathin ceramic sheet; carrying out surface treatment on the metal substrate, coating the metal substrate with the heat conduction glue through a coating technology, and carrying out drying semi-solidification; and carrying out hot pressing on the ultrathin ceramic sheet and the glued metal substrate. The ceramic metal composite substrate has a good heat conduction performance, and has a good heat matching performance with chips, and the method has a high production efficiency, and is in favor of realizing development of the substrate to a small, light and thin direction. Tape casting makes the production efficiency of the ultrathin ceramic sheet be high; and the heat conduction glue comprises the one-dimensional high heat conduction material, so thermal resistance between the ultrathin ceramic sheet and the metal substrate is reduced.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a ceramic-metal composite substrate and a preparation process thereof. Background technique [0002] In recent years, with the rapid development of electronic information technology, the integration of chips has been continuously improved, and the development of high-power LEDs has put forward higher requirements for packaging substrates. Electronic components are developing in the direction of small, light and thin, which requires The substrate is also developing in the direction of small, light and thin, and the substrate should also have high mechanical strength, good electrical properties, high reliability, and excellent thermal conductivity. The level of thermal conductivity of the substrate will directly affect the reliability and life of electronic devices. [0003] Silicon (Si) is the earliest substrate material used. It has the advantages of low cost and good thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02C04B35/10C04B35/195C04B35/581C04B35/622
CPCC04B35/10C04B35/195C04B35/581C04B35/622C04B37/023C04B37/028C04B2237/02
Inventor 王文君王双喜张丹李少杰黄永俊
Owner SHANTOU UNIV
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