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High-performance nitrogen-containing phenolic resin and its preparation method

A phenolic resin, high-performance technology, applied in the field of high-performance nitrogen-containing phenolic resin and its preparation, can solve the problems of unstable synthesis process, low nitrogen content in the polymer, unsatisfactory comprehensive performance, etc., and achieves thermal and ultraviolet stability, The effect of good electrical properties, good mechanical properties

Active Publication Date: 2018-04-06
江苏文昌电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The resin formed by polycondensation of phenols and aldehydes is called phenolic resin. Because of its rich source of raw materials, low price and simple production process, its products have excellent mechanical properties, heat resistance, dimensional stability, flame retardancy and Low smoke; therefore, it is widely used in the fields of electrical appliances and electronics. Due to the unstable synthesis process of traditional nitrogen-containing phenolic resin, the nitrogen content of the polymer is low, and the flame retardancy is not good. It is often necessary to add inorganic flame retardants for synergistic Flame retardant can achieve the ideal flame retardant performance, and excessive addition of inorganic flame retardants will lead to a decrease in its mechanical properties and unsatisfactory overall performance. A simple and convenient operation process has been developed, it is easier to control the reaction end point, and the reaction temperature is moderate. The productive rate of polymer is higher, and the higher phenolic resin of nitrogen content is the problem that those skilled in the art need to solve urgently

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a high-performance nitrogen-containing phenolic resin, and the nitrogen-containing phenolic resin includes the following components in parts by mass:

[0041] Component A: 4 parts

[0042] Component B: 9 parts

[0043] Component C: 50 parts

[0044] Catalyst: 20 parts

[0045] Thickener: 1 part

[0046] Lubricant: 0.5 parts

[0047] Curing accelerator: 1.0 parts

[0048] Curing agent: 2 parts;

[0049] Component A includes the following components in parts by mass: p-nitrogen-containing phenolic resin: 40 parts, phosphorus oxychloride: 14 parts, acid-binding agent: 2 parts;

[0050] The p-nitrogen-containing phenolic resin includes the following components in parts by mass: formaldehyde: 75 parts, phenol: 60 parts, melamine: 10 parts, ammonia water: 8 parts; the acid-binding agent is triethylamine;

[0051] Component B includes the following components in parts by mass: ortho nitrogen-containing phenolic resin: 85 parts, flame retardant: 20...

Embodiment 2

[0067] This embodiment provides a high-performance nitrogen-containing phenolic resin, and the nitrogen-containing phenolic resin includes the following components in parts by mass:

[0068] Component A: 8 parts

[0069] Component B: 5 parts

[0070] Component C: 60 parts

[0071] Catalyst: 30 parts

[0072] Thickener: 2 parts

[0073] Lubricant: 0.6 parts

[0074] Curing accelerator: 0.5 parts

[0075] Curing agent: 3 parts;

[0076] Component A includes the following components in parts by mass: p-nitrogen-containing phenolic resin: 60 parts, phosphorus oxychloride: 10 parts, acid-binding agent: 1 part;

[0077] The p-nitrogen-containing phenolic resin includes the following components in parts by mass: formaldehyde: 70 parts, phenol: 50 parts, melamine: 30 parts, ammonia water: 5 parts; the acid-binding agent is triethylamine;

[0078] Component B includes the following components in parts by mass: ortho nitrogen-containing phenolic resin: 70 parts, flame retardant: ...

Embodiment 3

[0094] This embodiment provides a kind of high-performance nitrogen-containing phenolic resin, and nitrogen-containing phenolic resin comprises the following components in parts by mass:

[0095] Component A: 6 parts

[0096] Component B: 15 parts

[0097] Component C: 40 parts

[0098] Catalyst: 25 parts

[0099] Thickener: 1 part

[0100] Lubricant: 0.8 parts

[0101] Curing accelerator: 1.0 parts

[0102] Curing agent: 5 parts;

[0103] Component A includes the following components in parts by mass: p-nitrogen-containing phenolic resin: 50 parts, phosphorus oxychloride: 12 parts, acid-binding agent: 3 parts;

[0104]The p-nitrogen-containing phenolic resin includes the following components in parts by mass: formaldehyde: 80 parts, phenol: 55 parts, melamine: 20 parts, ammonia water: 6 parts; the acid-binding agent is triethylamine;

[0105] Component B includes the following components in parts by mass: ortho nitrogen-containing phenolic resin: 80 parts, flame retard...

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PUM

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Abstract

The invention discloses high-performance nitrogen-containing phenolic resin. The nitrogen-containing phenolic resin is prepared from a component A, a component B, a component C, a catalyzer, a thickening agent, a lubricating agent, a curing accelerator and a cutting agent. The invention further relates to a preparation method of the high-performance nitrogen-containing phenolic resin. The preparation method is simple and easy to implement, safe and environmentally friendly, and the prepared nitrogen-containing phenolic resin has excellent fire resistance, high thermal stability, and good mechanical performance and electrical performance.

Description

technical field [0001] The invention belongs to the field of preparation of phenolic resins, and in particular relates to a high-performance nitrogen-containing phenolic resin and a preparation method thereof. Background technique [0002] With the advent of the information age, electronic components have entered a new stage of high integration and high reliability. Installing their necessary substrates - printed circuit boards have become an indispensable and important component of most electronic products. As a printed circuit board The main substrate material in manufacturing, the copper clad laminate plays three main functions of conduction, insulation and support, the physical properties, processability and cost of the printed circuit board mainly depend on the substrate material, depending on the matrix resin used, the copper clad laminate can be Divided into phenolic resin base, epoxy resin base, polyester base and polyimide base and other types. [0003] The resin f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/34C08L61/18C08L83/04C08K13/02C08K3/32C08K5/49C08K5/5435C08K3/36C08K5/3445C08G14/10
CPCC08G14/10C08L61/34C08L2201/02C08L2201/08C08L2201/22C08L2203/206C08L2205/02C08L2205/025C08L2205/035C08L61/18C08L83/04C08K13/02C08K3/32C08K5/49C08K5/5435C08K3/36C08K5/3445C08L23/06C08K5/3477
Inventor 苏文国苏俊坡苏兴智黄梅奚盼张彬
Owner 江苏文昌电子科技有限公司
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