A method for manufacturing parts embedded with capillary structure pipes

Abstract

The invention discloses a method for manufacturing parts embedded with capillary structure pipes. Through additive manufacturing, the parts, tube body and capillary structure are integrated, which effectively improves the maximum heat transfer of parts and speeds up the heat conduction efficiency. The dimensions of the embedded pipe are flexibly designed according to the layout requirements of the heat dissipation space, which is especially suitable for the miniaturization of electronic equipment; at the same time, the high thermal conductivity formed by the capillary structure can meet the heat dissipation requirements per unit area of ​​high heat flux density electronic devices. The method also has the characteristics of simple and fast manufacturing method, low input cost, less consumables, etc., and can be widely used in heat dissipation and cooling of high heat flux density equipment such as electronics, machinery, chemistry, and space spacecraft.

Description

technical field [0001] The invention relates to the field of component manufacturing. Background technique [0002] The ability of a substance to conduct heat is called thermal conductivity. If some parts need to absorb or dissipate a lot of heat during use, materials with good thermal conductivity should be used. However, thermal conductivity is often not compatible with other properties such as mechanical properties when selecting part materials. In particular, many new materials (polymers, alloys, ceramics, etc.) developed in recent years have excellent mechanical properties, but when they are made into parts, the end close to the heat source or generating heat cannot quickly transfer heat to the end far away from the heat source. At one end, the temperature difference of the entire part is relatively large, which has a serious impact on the life of the part itself and the reliability of the entire device. [0003] In the prior art, the problem of heat dissipation of pa...

AI Technical Summary

Problems solved by technology

But the traditional method is difficult to deal with some tiny parts, especially the treatment of the inner surface of the parts, and even cause structural damage

With the rapid development of the microelectronics industry, the heat flux of electronic devices continues to increase. Traditional manufacturing techniques are difficult to improve the heat transfer limit of parts, which seriously limits the development of microelectronic components.

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