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Thermally-conductive and insulating polymer composite material with three-dimensional isolation structure and preparation method of thermally-conductive and insulating polymer composite material

A technology of thermally conductive insulating fillers and isolation structures, applied in the field of material science and engineering, can solve the problems of loss of mechanical properties, electrical insulation properties and processing and molding properties of polymer materials, and achieves benefits such as popularization and application, reduction of production costs, and excellent mechanical properties. performance effect

Inactive Publication Date: 2016-06-08
SOUTHWEAT UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The addition of a large amount of thermally conductive and insulating fillers loses the mechanical properties, electrical insulation properties and processing properties of polymer materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A method for preparing a thermally conductive and insulating polymer composite material with a three-dimensional isolation structure, comprising the steps of:

[0028] (1) Evenly mix 1 part of thermally conductive and insulating filler with 99 parts of polymer powder, and then prepare the core-shell structure of thermally conductive and insulating filler polymer powder by mechanical grinding, grinding pressure: 3MPa, grinding time 60min;

[0029] (2) Place the prepared heat-conducting and insulating filler polymer powder core-shell structure in a mold and perform hot-press molding to prepare a heat-conducting and insulating polymer composite material with a three-dimensional isolation structure. The molding pressure is 5 MPa and the molding temperature is 80°C. Molding time 10min.

[0030] Further, the polymer powder is a thermoplastic polymer powder, and the particle size of the polymer powder is 10 μm.

[0031] Furthermore, the polymer powder is polyethylene.

[003...

Embodiment 2

[0034] Roughly the same as Example 1, the only difference is:

[0035] In step (2), the molding temperature is 150°C;

[0036] The polymer powder is polypropylene;

[0037] The thermally conductive and insulating filler is boron nitride, and the particle size of the thermally conductive and insulating filler is 100 μm.

Embodiment 3

[0039] Roughly the same as Example 1, the only difference is:

[0040] In step (2), the molding temperature is 100°C;

[0041] The polymer powder is polyvinyl chloride;

[0042] The thermally conductive and insulating filler is aluminum nitride, and the particle size of the thermally conductive and insulating filler is 20 μm.

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PUM

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Abstract

The invention relates to thermally-conductive and insulating polymer composite material with a three-dimensional isolation structure and a preparation method of the thermally-conductive and insulating polymer composite material. The thermally-conductive and insulating polymer composite material comprises, by weight, 70-99 parts of polymer powder and 1-30 parts of thermally-conductive and insulating filler. The preparation method includes the steps of firstly, mixing the 1-30 parts of thermally-conductive and insulating filler with the 70-99 parts of polymer powder, and mechanically grinding to prepare a thermally-conductive and insulating filler@polymer powder core-shell structure, wherein the grinding pressure is 3-30MPa, and the grinding time is 5-60 minutes; secondly, placing the thermally-conductive and insulating filler@polymer powder core-shell structure into a die to prepare the thermally-conductive and insulating polymer composite material with the three-dimensional isolation structure through thermo-compression formation, wherein the formation pressure is 5-50MPa, the formation temperature is 80-350 DEG C, and the formation time is 10-60 minutes.

Description

technical field [0001] The invention relates to a heat-conducting and insulating polymer composite material with a three-dimensional isolation structure and a preparation method thereof, belonging to the field of material science and engineering. Background technique [0002] Polymer materials are widely used in various fields due to their outstanding advantages such as excellent chemical corrosion resistance, electrical insulation performance, light weight, and easy processing and molding. [0003] However, the thermal conductivity of most polymer materials is poor, and its intrinsic thermal conductivity is generally around 0.2W / m·K, which is far from meeting the requirements for insulation and heat dissipation and heat conduction applications. [0004] At present, the main method to improve the thermal conductivity of polymer materials is to fill them with insulating ceramic fillers with high thermal conductivity, such as alumina, boron nitride, aluminum nitride, etc. Gene...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08L23/12C08L27/06C08L25/06C08L75/04C08L69/00C08L77/00C08L33/12C08L67/02C08L59/00C08L71/12C08K3/00C08K3/22C08K3/38C08K3/28C08K3/34
CPCC08K3/22C08K3/28C08K3/34C08K3/38C08K2003/2227C08K2003/282C08K2003/385C08K2201/005C08L23/06C08L23/12C08L25/06C08L27/06C08L59/00C08L67/02C08L71/12C08L75/04C08L2205/02C08L2205/025C08L2205/035
Inventor 杨文彬唐小红廖治强程金旭吴菊英范敬辉张凯
Owner SOUTHWEAT UNIV OF SCI & TECH
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