Rapid multifunctional electronic component temperature characteristic measuring instrument and testing cavity

Abstract

The invention provides a rapid multifunctional electronic component temperature characteristic measuring device and instrument, and a testing cavity. Temperature characteristic curves of parameters such as capacitance, inductance, resistance, dielectric coefficients, dielectric loss, voltage-current curves and spontaneous polarization of a plurality of electronic components and material samples can be measured. The rapid multifunctional electronic component temperature characteristic measuring device and instrument and the testing cavity is small in size, light in weight, high in speed, high in automatic degree, multi-functional, high in precision and low in cost. The device, instrument and the testing cavity can be applied by an enterprise to rapidly detect temperature characteristics of electronic components, can also be used by scientific research laboratories to research temperature characteristics of specific parameters of the devices and the material samples, and can further be used in the aspect such as experiment demonstration and class teaching.

Description

technical field [0001] The invention relates to the field of electronic technology, and relates to a fast multifunctional electronic component temperature characteristic measuring instrument and a testing cavity. Background technique [0002] As an important environmental parameter, temperature directly affects the performance of electronic components. Most electronic equipment failures are caused by excessive temperature. Therefore, the control of temperature and the temperature drift characteristics of electronic component parameters are referred to as "temperature characteristics" for the system. Reliability is key. For semiconductor components, the temperature rise will reduce the maximum allowable power consumption of the transistor, and the rise of the junction temperature will cause the breakdown and damage of the P-N junction. Changes in temperature can lead to changes in the inductance and quality factor of the inductor; lead to changes in the capacitance and diele...

AI Technical Summary

Problems solved by technology

[0010] 1. The invention described in REF01 can measure a relatively large amount, but cannot measure the temperature characteristics of the parameters of multi-pin devices such as triodes, MOS tubes and ICs; due to the use of liquid nitrogen refrigeration, the overall volume of the equipment is relatively large , poor portability; limited by the technical level of the era, the temperature characteristics of the measured parameters need to be measured manually at each set temperature point, and the data collection and recording cannot be completed automatically

[0011] 2. The invention described in REF02 only involves double-terminal components, and due to the limitation of the single-chip AD converter, the measurement function and accuracy range are relatively limited. The heating method is controlled by a solenoid valve, which determines that the response speed of heating and cooling will be relatively slow. Slow, the liquid nitrogen cooling and resistance heating methods adopted also determine the large size of the equipment and are not portable

In addition, the invention does not reflect the scalability of the equipment

[0012] 3. The invention described in REF03 is only used for the measurement of resistance temperature characteristics. The heating element is the resistance to be tested itself, which saves the heating mechanism, but at the same time, it also has great limitations. For example, for resistance with high impedance, its constant current source The output voltage will be very high, the output power will be limited, and its heating temperature range will also be limited; its cooling method is natural cooling, resulting in a slow system response

The invention is limited to measuring the temperature characteristics of resistive elements with low impedance

[0013] 4. The invention described in REF04 is designed specifically for measuring MOS devices, it is not inherently scalable, and does not consider cooling mechanisms

[0014] Most of the existing inventions and published documents on measuring the temperature characteristics of components focus on measuring the temperature characteristics of a specific parameter of a specific component, in terms of the scalability of equipment functions and the scalability of measurement accuracy , without much consideration

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