A kind of preparation method of crystallizer copper plate coated with nickel-cobalt alloy layer
A crystallizer copper plate and nickel-cobalt alloy technology, applied in the field of electroplating, can solve the problems of long production cycle, internal stress accumulation of the coating, and many electroplating processes, etc., and achieve the effect of high thermal conductivity
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Embodiment 1
[0012] A method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. The composition of the mold copper plate in terms of mass percentage is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn : 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; The preparation method includes preparing a crystallizer with a copper alloy having the above composition, and electroplating a coating on the surface of the crystallizer The composition of the plating solution used in the electroplating is: nickel sulfate 220g / l, nickel chloride 19g / l, cobalt sulfate 5.5g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, Sodium lauryl sulfate 0.2g / l, additive 22ml / L, where the additive is a solution prepared by adding 10g sodium gluconate, 37g ascorbic acid and 22g dextrin into 1L water. The process conditions are: pH 2.3-3.5, Current density 4-5A / dm 2 , The temperature is 44-46℃, electroplating until the thickness of the coating is 1.3mm.
Embodiment 2
[0014] A method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. The composition of the mold copper plate in terms of mass percentage is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn : 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy with the above composition, and electroplating a coating on the surface of the crystallizer, The composition of the plating solution used in the electroplating is: nickel sulfate 240g / l, nickel chloride 17g / l, cobalt sulfate 6.5g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, ten Sodium dialkyl sulfate 0.4g / l, additive 20ml / L, the additive is a solution prepared by adding 12g sodium gluconate, 33g ascorbic acid and 26g dextrin into 1L of water. The process conditions are: pH 2.3-3.5, current Density 4-5A / dm 2 , The temperature is 44-46℃, electroplating until the thickness of the coating is 1.5mm.
Embodiment 3
[0016] A method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. The composition of the mold copper plate in mass percentage is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn :1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above composition, and electroplating a coating layer on the surface of the crystallizer, The composition of the plating solution used in the electroplating is: nickel sulfate 230g / l, nickel chloride 18g / l, cobalt sulfate 6.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, ten Sodium dialkyl sulfate 0.3g / l, additive 21ml / L, where the additive is a solution prepared by adding 11g sodium gluconate, 34g ascorbic acid and 24g dextrin into 1L water. The process conditions are: pH 2.3-3.5, current Density 4-5A / dm 2 , The temperature is 44-46℃, electroplating until the thickness of the coating is 1.4mm.
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