A kind of preparation method of crystallizer copper plate coated with nickel-cobalt alloy layer

A crystallizer copper plate and nickel-cobalt alloy technology, applied in the field of electroplating, can solve the problems of long production cycle, internal stress accumulation of the coating, and many electroplating processes, etc., and achieve the effect of high thermal conductivity

Active Publication Date: 2018-03-23
慈溪市万金电子元件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of continuous casting technology, copper plate electroplating technology develops rapidly: the coating material develops from simple metal to alloy material, from chromium to nickel to nickel-iron, nickel-cobalt alloy, and the coating form develops from composite layer to single layer. This functional electroplating Different from ordinary electroplating, the coating is relatively thick, usually with a thickness of 0.2mm-2mm, which inevitably leads to a large accumulation of internal stress in the coating. In the continuous casting production of copper plates, the coating working surface is in the environment of high-temperature molten steel and cooling water. Frequent alternation can induce cracks in the coating, and sometimes the coating will fall off, which affects the amount of steel passed through the copper plate and affects the production efficiency of the continuous casting machine
Moreover, there are many electroplating processes and the production cycle is long

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. The composition of the mold copper plate in terms of mass percentage is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn : 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; The preparation method includes preparing a crystallizer with a copper alloy having the above composition, and electroplating a coating on the surface of the crystallizer The composition of the plating solution used in the electroplating is: nickel sulfate 220g / l, nickel chloride 19g / l, cobalt sulfate 5.5g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, Sodium lauryl sulfate 0.2g / l, additive 22ml / L, where the additive is a solution prepared by adding 10g sodium gluconate, 37g ascorbic acid and 22g dextrin into 1L water. The process conditions are: pH 2.3-3.5, Current density 4-5A / dm 2 , The temperature is 44-46℃, electroplating until the thickness of the coating is 1.3mm.

Embodiment 2

[0014] A method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. The composition of the mold copper plate in terms of mass percentage is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn : 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy with the above composition, and electroplating a coating on the surface of the crystallizer, The composition of the plating solution used in the electroplating is: nickel sulfate 240g / l, nickel chloride 17g / l, cobalt sulfate 6.5g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, ten Sodium dialkyl sulfate 0.4g / l, additive 20ml / L, the additive is a solution prepared by adding 12g sodium gluconate, 33g ascorbic acid and 26g dextrin into 1L of water. The process conditions are: pH 2.3-3.5, current Density 4-5A / dm 2 , The temperature is 44-46℃, electroplating until the thickness of the coating is 1.5mm.

Embodiment 3

[0016] A method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. The composition of the mold copper plate in mass percentage is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn :1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above composition, and electroplating a coating layer on the surface of the crystallizer, The composition of the plating solution used in the electroplating is: nickel sulfate 230g / l, nickel chloride 18g / l, cobalt sulfate 6.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, ten Sodium dialkyl sulfate 0.3g / l, additive 21ml / L, where the additive is a solution prepared by adding 11g sodium gluconate, 34g ascorbic acid and 24g dextrin into 1L water. The process conditions are: pH 2.3-3.5, current Density 4-5A / dm 2 , The temperature is 44-46℃, electroplating until the thickness of the coating is 1.4mm.

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Abstract

The invention discloses a preparation method for a crystallizer copper plate coated with a nickel-cobalt alloy layer. The crystallizer copper plate is composed of, by mass, 1%-2% of Ni, 0.05%-0.2% of Be, 0.5%-0.7% of Al, 3.0%-5.0% of Zr, 1.2%-1.4% of Mn, 1%-3% of Mg, 0.8%-1.2% of Cr, 14.0%-16.0% of Zn and the balance Cu. The preparation method comprises the steps that a crystallizer is prepared from copper alloy comprising the components, and a coated layer is electroplated on the surface of the crystallizer. A plating solution adopted by electroplating is composed of 220-240 g / l of nickel sulfate, 17-19 g / l of nickel chloride, 5.5-6.5 g / l of cobalt sulfate, 23-27 g / l of boric acid, 5-7 g / l of potassium sulfate, 30-40 g / l of sodium chloride, 0.2-0.4 g / l of lauryl sodium sulfate and 20-22 ml / L of an additive, and the additive is a solution prepared by adding 10-12 g of sodium gluconate, 33-37 g of ascorbic acid and 22-26 g of dextrin into one liter of water. The conditions for an electroplating process are as follows, the PH value is 2.3-3.5, the electric current density is 4-5 A / dm<2>, the temperature is 44 DEG C-46 DEG C, and electroplating is conducted till the plating layer thickness reaches 1.3-1.5 mm.

Description

Technical field [0001] The invention relates to the field of electroplating technology, and in particular to a method for preparing a mold copper plate coated with a nickel-cobalt alloy layer. Background technique [0002] The copper plate of the mold is an important part of the continuous casting machine, and the molten steel flows through the mold of the continuous casting machine and is cooled to form a steel billet. In the process of continuous casting billet production, the surface of the steel billet and the copper plate contact each other to produce friction, and the surface of the copper plate is worn out. The surface of the copper plate is usually plated with a layer of good thermal conductivity and wear-resistant material to reduce the surface of the copper plate. The purpose of wear, increase the number of repairs of the copper plate, and extend the service life of the copper plate. With the development of continuous casting technology, copper plate electroplating tec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22D11/057C25D3/56C22C9/04
CPCB22D11/057C22C9/04C25D3/562
Inventor 苏昭缄
Owner 慈溪市万金电子元件有限公司
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