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Housing lead wire used for surface-mount package of microwave device and connecting structure thereof

A microwave device, shell lead technology, applied in the direction of electric solid device, semiconductor device, semiconductor/solid state device parts, etc., can solve the problem of poor microwave electrical signal transmission effect, microwave metal ceramic surface mount shell, microwave device performance It can achieve good signal transmission, weaken stress conduction, and release stress.

Inactive Publication Date: 2016-04-06
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the particularity of microwave transmission, the Z-shaped lead structure has poor microwave electrical signal transmission effect and poor performance of microwave devices, and has not been widely used in microwave metal ceramic surface mount housings.

Method used

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  • Housing lead wire used for surface-mount package of microwave device and connecting structure thereof
  • Housing lead wire used for surface-mount package of microwave device and connecting structure thereof
  • Housing lead wire used for surface-mount package of microwave device and connecting structure thereof

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0025] A housing lead for surface-mount packaging of microwave devices, see image 3 , the lead wire is in the shape of a flat strip, and the lead wire is provided with a bent section 61 in an Ω shape with a radius of 0.10 mm to 0.30 mm. The lead wire is a straight line section outside the bent section 61 . The selection of the radius of the bending section 61 is related to the thermal expansion coefficient of the ceramic and the PCB4 material used by the user during secondary installation. The larger the difference in thermal expansion coefficient, the larger the radius of the bending section 61 is, and the radius is controlled within the range of 0.10mm to 0.30mm. The resulting transmission inductance does not affect the transmission of microwave signals.

[0026] As a further improvement to the technical solution, the curved section 61 is a semicircle or an arc larger than a semicircle. The curved section 61 is a semicircle to facilitate processing, but if the thermal expa...

specific Embodiment approach 2

[0029] A lead wire connection structure of a microwave device surface mount package shell, see Figure 4 and Figure 5 , comprising a package shell, lead wires and PCB4, said package shell includes an upper metal wall 1 and a lower ceramic base 3; said lead wire is in the shape of a flat strip, and a bent section 61 is provided on the lead wire, which is in an Ω shape with a radius of 0.10mm~0.30mm, the lead wire is a straight line segment outside the bending section 61, the straight line segment of the lead wire is laid flat on the PCB4, the two straight line ends of the lead wire are the lead-in end 62 and the lead-out end 63 respectively, the lead-in end 62 Welded on the bottom of the ceramic base 3, the lead end 63 is welded on the printed circuit board, the bent section 61 of the lead is suspended, and the bent section 61 of the lead is located at a position 0.10 mm to 0.30 mm outside the ceramic base 3 . The material of the lead wire is Kovar alloy. The curved section...

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Abstract

The present invention relates to the field of surface mounting technology, and specially discloses a housing lead wire used for a surface-mount package of a microwave device and a connecting structure that uses the lead wire. The lead wire is flat and ribbon-shaped, is provided with a bending section that is omega-shaped and that has a radius of 0.10 mm - 0.30 mm, and the lead wire, except the bending section, is a straight line segment. The bending section is an arc that is a semicircle or greater than a semicircle. Two straight line end portions of the lead wire are a lead-in end and a lead-out end respectively; the lead-in end is used for connecting a package housing; the lead-out end is used for connecting a printed circuit board; and the bending section of the lead wire is close to the lead-out end. In the connecting structure, the distance between a bending degree and a ceramic base is 0.10 mm - 0.30 mm. According to the housing lead wire used for a surface-mount package of a microwave device and the connecting structure, a lead wire has better tensile and anti-plastic deformation performance, and also has a better microwave electric signal transmission capability; and by applying the lead wire to a microwave device, a tensile stress that the lead wire exerts on a housing when a temperature changes can be reduced or eliminated, and reliability of the device and better microwave performance can be ensured.

Description

technical field [0001] The invention relates to the technical field of surface mounting of microwave devices, in particular to the technical field of packaging shells of microwave devices. Background technique [0002] As a representative of high-reliability packaging in semiconductor packaging technology, metal-ceramic packaging is widely used in microwave power devices because its base is multilayer ceramics, suitable for high-density circuit wiring and device integration, and has the advantages of good high-frequency characteristics and low noise. [0003] As a part of the packaging case, the lead wire acts as a transmission bridge for electrical signals, which transmits the signal from the chip inside the packaging case to the signal line on the printed circuit board (PCB) on which the device is mounted. important. Kovar alloy is the preferred material for surface-mounted microwave ceramic shell leads, which has little difference in expansion coefficient from ceramics, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49
CPCH01L23/49
Inventor 梁向阳赵祖军李明磊
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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