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A kind of polyimide containing carbazole structure and its preparation method and application

A polyimide and polyimide film technology, applied in the field of material science, can solve the problems of failing to improve polymer barrier properties, change solubility, etc., and achieve high glass transition temperature and thermal stability, excellent Barrier properties, effect of low thermal expansion coefficient

Active Publication Date: 2018-09-04
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, introducing the planar structure into the polymer chain in the form of side groups cannot achieve the effect of improving the barrier properties of the polymer, but can only change its solubility (such as patents CN 102352039 A, CN102766085 A, etc.)
However, as certain high-barrier fields put forward higher requirements for material heat resistance, there are still few researches on polyimide materials with excellent thermal properties and high barrier properties at the same time, so it is necessary to develop excellent thermal properties. Design and synthesis of polyimide with high barrier properties

Method used

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  • A kind of polyimide containing carbazole structure and its preparation method and application
  • A kind of polyimide containing carbazole structure and its preparation method and application
  • A kind of polyimide containing carbazole structure and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] At room temperature, 3.9348g (0.01mol) N1,N1'-(9-methyl-9H-carbazole-3,6-diyl)bis-(benzene-1,4-diamine)(9-M-CNPDA) and 57.3 Add g (60.7ml) N,N-dimethylformamide into a 100ml three-necked flask, pass in argon gas, stir, and after completely dissolving, add 2.1812g (0.01mol) 1,2,4,5-Benzenetetracarboxylic anhydride (1,2,4,5-Pyromellitic dianhydride, PMDA), and continue to stir for 6 hours to obtain a homogeneous transparent and viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate after removing air bubbles, then place the glass plate in a vacuum oven and vacuumize. The heating program is as follows: the room temperature is raised to 100°C, and then the temperature is kept constant for 1h→100°C to 200°C. After constant temperature, the whole process is 1h→200°C and the temperature is raised to 300°C. The whole process of constant temperature is 1h~300°C and the temperature is raised to 400°C. The infrared spectrum of the polyi...

Embodiment 2

[0046] At room temperature, mix 4.3548g (0.01mol) N3, N6-bis(4-aminophenyl)-9H-carbazole-3,6-dicarbazole-xamide (CAPDA) and 51.1g (58.4ml) N,N-dimethyl form Add the amide into a 100ml three-necked flask, pass in argon, stir, and after it is completely dissolved, add 2.1812g (0.01mol) of 1,2,4,5-Benzenetetracarboxylicanhydride (1,2,4,5-pyromellitic acid di anhydride, PMDA), and continued stirring for 6h to obtain a homogeneous transparent and viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate after removing air bubbles, then place the glass plate in a vacuum oven and vacuumize. The heating program is as follows: the room temperature is raised to 100°C, and then the temperature is kept constant for 1h→100°C to 200°C. After constant temperature, the whole process is 1h→200°C and the temperature is raised to 300°C. The whole process of constant temperature is 1h~300°C and the temperature is raised to 400°C. The infrared spectrum of ...

Embodiment 3

[0050] At room temperature, 3.8148g (0.01mol) 4,4'-((9H-carbazole-3,6-diyl)bis(oxy))dianiline (CEPDA) and 63.9g (67.7ml) N,N-dimethyl Formamide was added to a 100ml three-necked flask, filled with argon, stirred, and after it was completely dissolved, 2.1812g (0.01mol) of 1,2,4,5-Benzenetetracarboxylicanhydride (1,2,4,5-pyromellitic acid Dianhydride, PMDA), continue stirring reaction 6h, obtain homogeneous transparent viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate after removing air bubbles, then place the glass plate in a vacuum oven and vacuumize. The heating program is as follows: the room temperature is raised to 100°C, and then the temperature is kept constant for 1h→100°C to 200°C. After constant temperature, the whole process is 1h→200°C and the temperature is raised to 300°C. The whole process of constant temperature is 1h~300°C and the temperature is raised to 400°C. The infrared spectrum of the polyimide film is sh...

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Abstract

The invention discloses polyimide containing a carbazole structure, a preparation method thereof and application thereof. According to the polyimide, carbazole structure included aromatic diamines high in planarity and various tetracid dihydride are used as raw materials to prepare polyimide powder materials or film through thermal imidization or chemical imidization. The lowest energy state structure of diamine monomers have high planarity and rigidity, the prepared polyimide molecular chain is stacked tightly and has outstanding blocking performance, high glass-transition temperature and heat stability as well as low thermal expansion coefficient. The polyimide preparation method is simple and diversified in process and applicable to industrial production. The polyimide can be widely applied to the field of high and new technology industries such as microelectronics, war industry, aerospace, high-performance packaging and protection and electronic device packaging.

Description

technical field [0001] The invention relates to the field of material science, in particular to a novel polyimide containing a carbazole structure and a preparation method thereof. technical background [0002] Polyimide has excellent thermal performance due to the imide ring in its main chain. It is one of the best heat-resistant varieties among engineering plastics that have been industrialized at present. It has comprehensive properties that other engineering plastics cannot match, such as High mechanical strength, good high and low temperature resistance, excellent dielectric properties, good film-forming properties, etc. PI is used in various fields, especially in flexible display, aerospace, microelectronics and military fields. [0003] With the development of the flexible display industry, it puts forward higher requirements for PI. Generally, PI is required not only to have excellent thermal properties, but also to have excellent barrier properties. Taking OLED d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1007C08G73/1085C08J5/18C08J2379/08
Inventor 刘亦武黄杰谭井华曾义张海良魏珊珊刘跃军向贤伟
Owner HUNAN UNIV OF TECH
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