Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy

Abstract

The invention relates to the field of heat conduction materials and provides low-melting-point alloy. The low-melting-point alloy comprises, by mass, 47.0-50.8% of indium, 29.5-32.3% of bismuth, 13.5-16.3% of tin and 0.67-10% of gallium. A preparation method of the low-melting-point alloy comprises the steps that A, all the constituents are weighed according to requirements; B, the furnace temperature is increased to 350 DEG C, the bismuth and the tin are placed into a ceramic crucible, the ceramic crucible is placed into a smelting furnace to be heated, after the bismuth and the tin are melted, surface oxide is removed, and stirring is conducted; C, the furnace temperature is adjusted to 200 DEG C, the indium is added, and after the indium is completely melted, surface slagging-off and stirring are conducted; D, the furnace temperature is adjusted to 100 DEG C, the gallium is added, and slagging-off and standing are conducted after stirring; and E, the crucible is taken out, the alloy is poured into a mold, and cooling is conducted. The melting point of the low-melting-point alloy is 40-60 DEG C, the low-melting-point alloy is used for low-junction-temperature occasions in a phase-change mode, and the application space of liquid metal thermal interface materials is enlarged; harmful elements such as lead and cadmium are not contained in the low-melting-point alloy product, and environment protection is facilitated. The preparation method is simple in technological requirement, and the whole process can be conducted in the atmospheric environment.

Description

technical field [0001] The invention relates to the field of heat-conducting materials, in particular to a low-melting-point alloy with a melting point of 40-60°C and a preparation method thereof. Background technique [0002] Thermally conductive silicone sheet is a key material for heat dissipation of electronic components. This is mainly due to the obvious thermal contact resistance formed between the surface of the heat source and the heat sink, which reduces the efficiency of the heat sink. The thermally conductive silicone sheet is filled between the heat source and the radiator, which can eliminate the air in the interface and establish an effective heat conduction channel between them, reducing contact thermal resistance and improving heat transfer performance. Traditional heat conduction sheets are made of silicone oil-based filled with high thermal conductivity particles and cured. The higher thermal conductivity is generally 5W / (m·k). Organic material thermal pa...

AI Technical Summary

Problems solved by technology

However, in many electronic products such as mobile phones, the interface temperature between the heat source and the heat dissipation device cannot reach the melting point of the eutectic alloy, and the performance of the liquid metal heat conduction sheet cannot be effectively exerted.