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Method, device and machine for switching photomasks in auxiliary photolithography area machine

A photomask and engraved area technology, which is applied in microlithography exposure equipment, photolithographic process exposure devices, electrical components, etc. Reduce the switching time, avoid the delay of waiting for exposure time, and increase the effect of machine production capacity

Active Publication Date: 2017-11-03
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] However, this method of switching masks does not take into account the relationship between the front and back processes of the photolithography area. The wafers enter the front and back processes in series. If the appropriate mask corresponding to the wafer is not switched in time, it will lead to mask switching. If the time is too long, together with the process progress affecting subsequent wafers, the output of the machine will be reduced; especially when the load on the production line is heavy, it is difficult to grasp the timing of switching the mask, resulting in low production efficiency

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  • Method, device and machine for switching photomasks in auxiliary photolithography area machine
  • Method, device and machine for switching photomasks in auxiliary photolithography area machine
  • Method, device and machine for switching photomasks in auxiliary photolithography area machine

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Embodiment Construction

[0054] In order to make the purpose, features and effects of the present invention more obvious and understandable, the specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0055] Many specific details are set forth in the following description to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways than described here, so the present invention is not limited by the specific embodiments disclosed below.

[0056] In semiconductor photolithography technology, in order to make the pattern of wafer products, photolithography will be used to control the etching process. After the photolithography process is completed, a layer of photoresist film will be formed on the surface of the film, which is compatible with the required fabrication. The patterns are consistent and can protect the underlying metal film from being etched durin...

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Abstract

The invention relates to a method, a device and a machine for assisting a machine in a photolithography area to switch a photomask. The method includes: delivering goods to the machine in the lithography area, each wafer can enter the functional groove chamber on the machine in the lithography area and thus form the running track of each wafer, so The functional slots on the machine in the photolithography area include functional slots related to exposure; monitor the running track of the wafer; Before exposing the relevant functional tank chamber, send out information related to switching reticles. The invention can assist to switch the photomask in the photolithography area, control the switching time, and improve the output of the machine.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method, a device and a machine for assisting a machine in a photolithography area to switch a photomask. Background technique [0002] In semiconductor manufacturing, the photolithography area is an important area that affects productivity. The machines in the lithography area are expensive, and the process is precise and complicated. At the same time, it is accompanied by the binding of the machines in the lithography area between the previous and subsequent processes to eliminate the deviation of lithography. Therefore, there are many factors that affect the production capacity. [0003] In the photolithography process, the reticle is the core element of the photolithography area, which defines the pattern of the product. In factory production, the mask patterns used for different products and different processes of the same product may be different. In this case, the...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/67
Inventor 方利黄亮张宛铮
Owner SEMICON MFG INT (SHANGHAI) CORP
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