Method and device for assisting switching photomask of photolithography area machine and machine

Abstract

The invention relates to a method and a device for assisting a switching photomask of a photolithography area machine and the machine. The method comprises the following steps: sending goods for the photolithography area machine, wherein each wafer can enter into a functional groove cavity on the photolithography area machine so as to form a moving trajectory of each wafer, and the functional groove cavity on the photolithography area machine comprises a functional groove related to exposure; monitoring the moving trajectories of the wafers; and if the exposure of the wafers needs the switching photomask, sending out information related to the switching photomask before the moving trajectories show that the wafers enter the functional groove cavity related to exposure. The switching photomask can be assisted in a photolithography area, so that the switching time is controlled, and the yield of the machine is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method, a device and a machine for assisting a machine in a photolithography area to switch a photomask. Background technique [0002] In semiconductor manufacturing, the photolithography area is an important area that affects productivity. The machines in the lithography area are expensive, and the process is precise and complicated. At the same time, it is accompanied by the binding of the machines in the lithography area between the previous and subsequent processes to eliminate the deviation of lithography. Therefore, there are many factors that affect the production capacity. [0003] In the photolithography process, the reticle is the core element of the photolithography area, which defines the pattern of the product. In factory production, the mask patterns used for different products and different processes of the same product may be different. In this case, the...

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Problems solved by technology

[0005] However, this method of switching masks does not take into account the relationship between the front and back processes of the photolithography area. The wafers enter the front and back processes in series. If the appropriate mask corresponding to the wafer is not switched in time, it will lead to mask switching. If the time is too long, together with the process progress affecting subsequent wafers, the output of the machine will be reduced; especially when the load on the production line is heavy, it is difficult to grasp the timing of switching the mask, resulting in low production efficiency

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