Imidazole compound, preparation method and thermosetting composition containing imidazole compound

An imidazole compound and compound technology are applied in the field of imidazole compounds and compositions using the compounds to achieve the effects of high strength, high toughness and excellent toughness

Inactive Publication Date: 2016-02-17
GUANGDONG HINNO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide an imidazole compound to improve the toughness, long impact performance, crack resistance of existing thermosetting composite materials and reduce or avoid the problem of powder falling during punching molding

Method used

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  • Imidazole compound, preparation method and thermosetting composition containing imidazole compound

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Experimental program
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Effect test

Embodiment 2

[0041] Take 2% imidazole and 98% polymethyl methacrylate by weight percentage, respectively dissolve imidazole and polymethyl methacrylate in methyl formamide solvent, mix the two solutions and heat and stir to produce For the copolymerization reaction, the heating temperature is 70° C., the stirring speed is 500 rpm, and the copolymerization reaction time is 50 minutes to obtain an imidazole compound solution containing polymethyl methacrylate groups.

Embodiment 3

[0043] Get 4% imidazole by weight percentage, and 96% phenoxy resin, dissolve imidazole and phenoxy resin in methyl formamide solvent respectively, after two kinds of solutions are mixed, heat and stir to produce copolymerization reaction, heating temperature is 80° C., the stirring speed is 400 rpm, and the copolymerization reaction time is 80 minutes to obtain an imidazole compound solution containing phenoxy resin groups.

[0044] Imidazole compound production embodiment four:

[0045] Take 6% imidazole, 40% nitrile rubber, 30% polymethyl methacrylate and 24% phenoxy resin by weight percentage, and dissolve the above-mentioned substances in a mixed solvent of butanone, toluene, and propylene glycol methyl ether respectively In the process, the above solutions are mixed and then heated and stirred to produce a copolymerization reaction. The heating temperature is 80°C, the stirring speed is 200 rpm, and the copolymerization reaction time is 80 minutes. Group and imidazole c...

Embodiment 1

[0093] 10 mass parts of the imidazole compound containing the nitrile rubber group and 15 mass parts of the imidazole compound containing the polymethyl methacrylate group are dissolved in 54 mass parts of butanone and toluene in a ratio of 1:1:1 , propylene glycol methyl ether mixed solvent, at 50°C, stir for 2 hours, after the two imidazole compounds are completely dissolved, then add 10 parts by mass of phenolic curing agent, 12 parts by mass of silicon dioxide, 12.5 parts by mass of Talc powder, 40 parts by mass of bisphenol-A epoxy resin, 0.5 parts by mass of 2-phenylimidazole, and continue to stir evenly to prepare a glue solution, impregnate the above glue solution with 7628 type E glass cloth, and heat it at 165 ° C Dry to remove the solvent to obtain a prepreg with a resin content of 45%. Stack 5 pieces of the prepregs obtained, arrange a release film with a thickness of 30 microns on the upper and lower sides, and place them in a vacuum press with programmable temper...

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Abstract

The invention discloses a general formula (I) of an imidazole compound. The novel imidazole compound is prepared by prepolymerizing macromolecular or super-large molecular compounds such as buna-n rubber, polymethyl methacrylate and phenoxy resin which are difficult to dissolve with other chemical components with imidazole; the relevant problems generated when the materials such as the buna-n rubber, the polymethyl methacrylate and the phenoxy resin are applied to a thermosetting composition are solved, and the excellent characteristics such as the high tenacity, the high strength, the shock resistance, the low deformation and the performance of being free of powder dropping in die cutting of the imidazole compound are fully achieved by evenly and effectively mixing the imidazole compound with an epoxy compound, a curing cross-linking agent, a curing accelerator, granulous reinforced inorganic filler and the like; a die pressing material, a laminated material, a casting material and the like which are prepared from the thermosetting composition have the advantages of being excellent in tenacity, strength and shock resistance, low in deformation after thermal shock, free of powder dropping in die cutting and the like.

Description

technical field [0001] The invention relates to an imidazole compound and a composition using the compound, especially a compound capable of improving a thermosetting resin to have high strength, low deformation, high toughness and impact resistance and a corresponding composition. Background technique [0002] As a new type of material in the field of new materials, composite materials have been more and more widely used in various fields due to their advantages such as good insulation, chemical resistance, ring resistance, high strength, light weight, and easy processing. in the industry. With the rapid development of society and the accelerated consumption of various resources, human beings are increasingly concerned about their own living environment, and their requirements for composite materials are also getting higher and higher. For example, some composite materials that can replace steel and need to be used in high-strength structures, although they have advantages...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F8/30C08C19/22C08G59/14C08L63/02C08L15/00C08L33/12C08L63/00C08K13/02C08K3/34C08K3/36C08K5/3447
CPCC08C19/22C08F8/30C08G59/1477C08L63/00C08L2205/02C08L2205/03C08L2205/035C08F120/14C08L33/12C08L15/00C08K13/02C08K3/36C08K3/34C08K5/3447
Inventor 布施健明漆小龙郭永军张新权温文彦
Owner GUANGDONG HINNO TECH CO LTD
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