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Polyimide copolymer oligomer, polyimide copolymer, and method for producing each of same

A technology of polyimide copolymer and manufacturing method, which is applied in the direction of coating, adhesive, etc., can solve the problems of difficult handling and storage, and achieve the effect of satisfying solvent solubility and excellent practicability

Active Publication Date: 2016-02-10
SOMAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyamic acid solution is easily affected by humidity, and it is difficult to handle and store. In addition, since polyamic acid imidization requires heat treatment at about 350°C, it is limited to coating on heat-resistant materials. the use of

Method used

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  • Polyimide copolymer oligomer, polyimide copolymer, and method for producing each of same
  • Polyimide copolymer oligomer, polyimide copolymer, and method for producing each of same
  • Polyimide copolymer oligomer, polyimide copolymer, and method for producing each of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] 3,3',4,4'-Biphenyltetracarboxylate was added to a 500 mL detachable 4-neck flask equipped with a stainless steel anchor stirrer, a nitrogen gas introduction tube, and a Dean-Stark apparatus (Dean-Starkapparatus). Acid dianhydride (BPDA) 66.52g (0.225 mol), diethyltoluenediamine (DETDA) 32.09g (0.18 mol), N-methyl-2-pyrrolidone (NMP) 100g, pyridine 3.56g, toluene 50g, the Nitrogen replacement was carried out in the reaction system. After dissolving BPDA by stirring at 80° C. for 30 minutes under a nitrogen stream, the temperature was raised to 180° C., and heating and stirring were performed for 2 hours. Water produced by the reaction was removed outside the reaction system by azeotropic distillation with toluene.

[0089] Next, it cooled to 120 degreeC, pDADE9.01g (0.045 mol), and NMP84.22g were added and stirred for 5 minutes, it heated up to 180 degreeC, and it reacted for 6 hours, heating and stirring. Water produced during the reaction was removed outside the reac...

Embodiment 2

[0093] BPDA 41.49g (0.141 mol), DETDA 33.52g (0.188 mol), NMP 84.89g, pyridine 3.72g, and toluene 50g were added to the same apparatus as in Example 1, and the reaction system was replaced with nitrogen. After dissolving BPDA by stirring at 80° C. for 30 minutes under a nitrogen stream, the temperature was raised to 180° C., and heating and stirring were performed for 2 hours. Water produced by the reaction was removed outside the reaction system by azeotropic distillation with toluene.

[0094] Next, cool to 130°C, add 12.52g (0.047mol) of 1-(4-aminophenyl)-1,3,3-trimethyl-1H-indene-5(or 6)-amine (TMDA) and 50g of NMP And after stirring for 5 minutes, PMDA20.74g (0.094mol) and NMP50g were added, it heated up to 180 degreeC, and it reacted for 6 hours, heating and stirring. Water produced during the reaction was removed outside the reaction system as an azeotropic mixture with toluene and pyridine. After completion|finish of reaction, the polyimide solution of 25 mass % dens...

Embodiment 3

[0098]40.60 g (0.138 mol) of BPDA, 16.40 g (0.092 mol) of DETDA, 83.69 g of NMP, 2.91 g of pyridine, and 50 g of toluene were added to the same apparatus as in Example 1, and the reaction system was replaced with nitrogen. After dissolving BPDA by stirring at 80° C. for 30 minutes under a nitrogen stream, the temperature was raised to 180° C., and heating and stirring were performed for 2 hours. Water produced by the reaction was removed outside the reaction system by azeotropic distillation with toluene.

[0099] Next, cool to 130°C, add 32.06 g (0.092 mol) of 9,9-bis(4-aminophenyl)fluorene (FDA) and 60 g of NMP, stir for 5 minutes, and then add 3,3',4,4'- 16.86 g (0.046 mol) of diphenyl sulfone tetracarboxylic dianhydrides (DSDA), NMP40g, heated up to 180 degreeC, and performed reaction for 6 hours, heating and stirring. Water produced during the reaction was removed outside the reaction system as an azeotropic mixture with toluene and pyridine. After completion|finish of ...

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Abstract

Provided are: a polyimide copolymer oligomer that satisfies a high level of solvent solubility, storage stability, and heat resistance, and that is the precursor material for a polyimide copolymer having superior utility; a polyimide copolymer obtained therefrom; and a method for producing each of same. The present invention results from the co-polymerization of (A) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and / or 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride and (B) at least one diamine and / or diisocyanate represented by general formulae (1) to (3) (in the formulae: X is an amino group or an isocyanate group; R<1>-R<8> each independently represent a hydrogen atom, an alkyl group having 1-4 carbon atoms, an alkenyl group having 2-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms; and at least one of R<1>-R<8> is not a hydrogen atom).

Description

technical field [0001] The present invention relates to polyimide copolymer oligomers (hereinafter also simply referred to as "oligomers"), polyimide copolymers, and their production methods. Specifically, it relates to highly satisfying solvent solubility and storage stability. The polyimide copolymer oligomer which is a polyimide copolymer intermediate which is excellent in practicability, and heat resistance, a polyimide copolymer, and their manufacturing methods. Background technique [0002] Polyimide is a polymer material with the highest level of heat resistance, chemical resistance, and electrical insulation among organic materials. It is composed of pyromellitic dianhydride (PMDA) and 4,4'-diaminodi DuPont's "Kapton (registered trademark)" synthesized from phenyl ether (pDADE), Ube Industries (KK)'s "UPILEX" synthesized from biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (pPD) (registered trademark)” are widely used as heat-resistant insulating m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/1042C08G73/105C08G73/1064C08G73/1067C08G73/1071C08G73/16C09D179/08C09J179/08C08G73/1028C08G75/20C08G75/23
Inventor 泷上义康
Owner SOMAR CORP
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