Manufacturing method of epoxy glass-cloth-matrix copper clad laminate

Abstract

The invention provides a manufacturing method of an epoxy glass-cloth-matrix copper clad laminate. The manufacturing method comprises the following steps: 1) preparing a glue solution; 2) getting a roll of alkali-free glass fiber cloth, opening the roll, and immersing the roll into the glue solution by passing the roll through a glue container at a speed of 70-80 m / min; 3) sending the roll to a drying chamber for drying to obtain a prepreg; 4) cutting the dried base board into pieces, laminating 8 pieces of the base board into one group, covering two surfaces of the plurality of laminated base boards with copper foil, putting a layer of a release film on the bottom of the plurality of laminated base boards, and putting the obtained product between two stainless steel plates; and 5) putting the obtained product into a laminating machine for heating and pressurization, taking the obtained product out, and performing cutting and checking to obtain a finished product of the epoxy glass-cloth-matrix copper clad laminate. According to the method, a special-prepared brominated bisphenol A epoxy resin is mixed with a plurality of preparations to form the glue solution, and manufacturing processes and manufacturing conditions are optimized and combined to obtain the copper clad laminate with high-temperature resistance and good flame resistance.

Description

technical field [0001] The invention relates to a method for manufacturing epoxy-type glass cloth-based copper-clad laminate base paper. Background technique [0002] Copper Clad Laminate base paper (CopperClad Laminate, CCL) is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing, referred to as For copper clad laminates. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality and manufacturing of printed circuit boards The processability, manufacturing level, manufacturing cos...

AI Technical Summary

Problems solved by technology

[0007] (1) When not toughened, the cured product is generally brittle, with poor peeling, cracking and impact resistance

[0008] (2) Low adhesion to materials with low polarity (such as polyethylene, polypropylene, fluoroplastics, etc.)

[0009] (3) Some raw materials such as reactive diluents, curing agents, etc. have varying degrees of toxicity and irritation

[0012] However, the high-performance resin-modified epoxy resin used in it has poor tracking resistance due to the presence of a large number of benzene rings.

Moreover, the use of such a modified epoxy resin requires a higher curing temperature when processing the board; in addition, it will react slowly at room temperature, so that the storage period of the adhesive sheet is greatly shortened. In addition, the system does not have ultraviolet light. blocking function

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