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Thermoplastic electromagnetic wave shielding film used for rapid processing

A shielding film, electromagnetic wave technology, applied in the fields of magnetic field/electric field shielding, electrical components, layered products, etc., can solve the problems of large connection resistance, high cost, increased cost, etc., to ensure heat resistance and conductivity, and broaden the application. range, the effect of increasing the processing speed

Active Publication Date: 2015-12-02
BAODING LUCKY INNOVATIVE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It needs to be laminated at about 180°C for 3 minutes, and then cured at 160°C for 30 minutes. Only then can the thermosetting conductive adhesive have excellent adhesion and conductive filling properties with the flexible circuit board. The connection resistance required for conductive filling is less than 1000mΩ, under rapid processing conditions, the thermosetting conductive adhesive layer has large connection resistance, insufficient conductive filling, and insufficient adhesion fastness, so it cannot be applied to flexible circuit boards by rapid processing
Moreover, the existing known thermosetting electromagnetic wave shielding film has a short shelf life of the conductive adhesive layer at room temperature and needs to be refrigerated, which increases storage and transportation costs, shortens the user's application time, and increases the application cost.
With the development of multifunctional 3C products such as tablet computers and smart phones, the demand for shielded flexible connections has increased, and the lower processing efficiency and higher cost have affected the application of 3C products.

Method used

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  • Thermoplastic electromagnetic wave shielding film used for rapid processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] First prepare the conductive adhesive, the proportion of thermoplastic conductive adhesive is as follows:

[0042] Thermoplastic polyamideimide resin H901-25 parts

[0043] Thermoplastic polyurethane resin desmocoll? 540 / 410 parts

[0044] Thermoplastic acrylic resin B48N 5 parts

[0045] Fumed silica R9725 parts

[0046] Dendritic silver-coated copper powder ACAX-22520 parts

[0047] Antioxidant B9002 parts

[0048] 8 parts of nitrogen methyl pyrrolidone

[0049] Xylene 15 parts

[0050] Cyclohexanone 20 parts

[0051] Butanone 10 parts;

[0052] Dissolve and mix the mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin in the stirring and dissolving tank evenly, put them into the dispersion tank and add fumed silica, disperse for 30-50 minutes and then pass through the sand mill After 3-5 times, add the material to the self-rotating and revolving mixer, add dendritic metal powder, vacuumize and mix for 60-90 minutes, add antio...

Embodiment 2

[0056] First prepare the conductive adhesive, the proportion of thermoplastic conductive adhesive is as follows:

[0057] Thermoplastic polyamidoimide resin H9035 parts

[0058] Thermoplastic polyurethane resin desmocoll? 540 / 515 parts

[0059] Thermoplastic acrylic resin B48N 5 parts

[0060] Fumed silica R20210 parts

[0061] Dendritic silver-coated copper powder ACAX-22520 parts

[0062] Antioxidant 1685 parts

[0063] 10 parts of nitrogen methyl pyrrolidone

[0064] 10 parts xylene

[0065] Cyclohexanone 15 parts

[0066] Butanone 5 parts;

[0067] Dissolve and mix the mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin in the stirring and dissolving tank evenly, put them into the dispersion tank and add fumed silica, disperse for 30-50 minutes and then pass through the sand mill After 3-5 times, add the material to the self-rotating and revolving mixer, add dendritic metal powder, vacuumize and mix for 60-90 minutes, add antioxi...

Embodiment 3

[0071] First prepare the conductive adhesive, the proportion of thermoplastic conductive adhesive is as follows:

[0072] Thermoplastic polyamideimide resin H901-27 parts

[0073] Thermoplastic polyurethane resin desmocoll? 540 / 410 parts

[0074] Thermoplastic acrylic resin B48N10 parts

[0075] Fumed silica R9725 parts

[0076] Dendritic silver-coated copper powder ACAX-22523 copies

[0077] Antioxidant B9003 parts

[0078] 7 parts of nitrogen methyl pyrrolidone

[0079] 10 parts xylene

[0080] Cyclohexanone 15 parts

[0081] Butanone 10 parts;

[0082] Dissolve and mix the mixed solvent, polyamideimide resin, polyurethane resin and thermoplastic acrylic resin in the stirring and dissolving tank evenly, put them into the dispersion tank and add fumed silica, disperse for 30-50 minutes and then pass through the sand mill After 3-5 times, add the material to the self-rotating and revolving mixer, add dendritic metal powder, vacuumize and mix for 60-90 minutes, add anti...

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Abstract

The invention discloses a thermoplastic electromagnetic wave shielding film used for rapid processing. The electromagnetic wave shielding film comprises a base material, a release layer, an insulation protection layer, a metal layer and a thermoplastic conductive resin layer. The thermoplastic conductive resin layer is composed of a hybrid-type thermoplastic polyamide imide, thermoplastic hydroxyl polyurethane, thermoplastic acrylic resin, gas-phase silicon dioxide, conductive metal powder and anti-oxidants. The provided shielding film has the following advantages: the conductive resin layer has thermoplasticity, cold storage is not needed, and the shielding film can be processed on a flexible connection circuit rapidly and has excellent adhesion fastness, grounding filling ability and step filling ability.

Description

technical field [0001] The invention relates to the field of shielding films for electronic circuit packaging, in particular to a thermoplastic electromagnetic wave shielding film for rapid processing. Background technique [0002] With the demand for thinner and lighter electronic products and the high frequency of communication systems, the electromagnetic interference problems inside and outside electronic components are gradually becoming more serious, and electromagnetic shielding has become inevitable. 3C products, small and multi-functional electrical appliances have increasing requirements for electromagnetic shielding. [0003] At present, for circuit boards, including flexible circuit boards and hard boards, the way to achieve both practicability and operability against electromagnetic interference is to attach electromagnetic shielding films, especially ultra-thin circuits. Advantages of shielding effectiveness. The electromagnetic wave shielding films disclosed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B32B15/08B32B15/082B32B15/095B32B27/08B32B27/20B32B7/06B32B33/00
Inventor 罗超刘彦峰
Owner BAODING LUCKY INNOVATIVE MATERIALS
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