A hdi board manufacturing process to improve blind hole pad removal

Abstract

The invention belongs to the field of circuit board processing, and particularly relates to an HDI board manufacturing technology capable of improving blind hole cushion release. Controllability of belt sanding amount is realized by optimizing belt sanding parameters, the blind hole bottom is avoided from being combined with an electroplated layer critical interface, and the belt sanding efficiency after an electroplating process is improved; the copper thickness of a blind hole orifice is thinned through chemical copper reduction, the tensile stress for the blind hole bottom during sanding is reduced, and the risk of cushion release caused by microcracks formed at the blind hole bottom is reduced; the controllability of belt sanding amount is realized, the copper is reduced in a chemical copper reduction manner firstly before film withdrawl, the tensile stress for the blind hole bottom during sanding can be reduced, the formation of the microcracks at the blind hole bottom is avoided, and the risks of blind hole microcracks and cushion release can be reduced; the problems of microcracks and cushion release for an HDI board blind hole are solved; the cost is reduced, the success rate is improved, the consumption of materials is reduced, the ideas of energy conservation and environmental protection are met, and the HDI board manufacturing technology has great economic value and market prospect.

Description

Technical field [0001] The invention belongs to the field of circuit board processing, and specifically relates to an HDI board manufacturing process for improving blind hole de-padging. Background technique [0002] At present, in the prior art, for the hole-filling electroplated HDI board with resin plugging process, sanding with sanding is required after the tree plugging process, and the resin needs to be polished 3 times to remove the resin. In the later process, if the dot plating process is used for this kind of board, due to many factors such as hole filling parameters, the copper thickness of the orifice is often higher than the surface copper, or even more than the dry film, so the excess copper is removed by mechanical polishing. [0003] However, this process has the following risks: For ordinary HDI boards, the thickness of the electrical layer of the board is required to be 6-8μm. This type of board is sanded with sanding after the resin plug hole. The amount of sandi...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the huge risk of micro-cracks and stripping at the bottom of the blind hole caused by the grinding process in the prior art, thereby providing a method for improving the contact between the bottom of the blind hole and the electroplated layer during spot plating. Bonding force; realize controllable amount of abrasive belt grinding, avoid the formation of micro-cracks at the bottom of blind holes, and at the same time reduce the risk of micro-cracks and pad removal in blind holes; improve the problem of micro-cracks and pad removal in blind holes of HDI boards; low cost, improve Improve the success rate, reduce the consumption of materials, and meet the concept of energy saving and environmental protection HDI board manufacturing process