Polysilicon floating gate memory based on organic field effect transistor and its preparation method
A technology of polysilicon and organic fields, which is applied in transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of high operating voltage and high manufacturing cost, and achieve the effects of reducing operating voltage, improving retention characteristics, and increasing mobility
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[0030] The present invention will be described in detail below in combination with specific embodiments.
[0031] The structure of the polysilicon floating gate memory based on the organic field effect transistor of the present invention is as figure 1 As shown, its preparation process is as follows:
[0032] 1) Put the cleaned heavily doped silicon wafer into a thermal oxidation furnace, and thermally oxidize and grow a layer of SiO with a thickness of about 150-300nm on the silicon surface. 2 Thin layer, forming the gate insulating dielectric layer 2 of the device, such as figure 2 .
[0033] 2) Using CVD method, on SiO 2 A polysilicon layer with a thickness of 20-40nm (deposition rate of about 5nm / min) grown on the surface is used as the floating gate 3 of the device, such as image 3 .
[0034] 3) Using the ion implantation method, perform low-concentration arsenic ion doping in the polysilicon floating gate region (the doping concentration is about 10 16 / cm 3 ). ...
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