Plastic packaging film used for laser moulds
A packaging film and mold technology, which is applied in the field of plastic packaging film for laser molds, can solve the problems that laser molds do not have a good protective effect, the cushioning effect and toughness do not meet the requirements, and the packaging film has poor wear resistance. Achieve excellent water resistance, low water absorption, and improve light resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0024] A plastic packaging film for laser molds, including an inner film, a buffer layer and an outer film; the raw materials of the inner film include: 100 parts of polyethylene resin, 531035 parts of low-density polyethylene, 40 parts of low-density polyethylene 221A, HD5502AA 45 parts, 30 parts of polyvinyl chloride, 20 parts of nylon, 20 parts of aluminum-based nanomaterials, 25 parts of cellulose, 5 parts of phosphite lipid stabilizer, 5.5 parts of acetyl tributyl citrate, 3.5 parts of benzoyl peroxide The buffer layer is polystyrene foam; the raw materials of the outer film include by weight: 75 parts of ethylene-propylene copolymer, 20 parts of ethylene-butylene copolymer, 10 parts of copolymerized polypropylene, 15 parts of homopolypropylene, polyethylene 30 parts of octene co-elastomer, 10 parts of calcium silicate.
Embodiment 2
[0026] A plastic packaging film for laser molds, including an inner film, a buffer layer and an outer film; the raw materials of the inner film include by weight: 80 parts of polyethylene resin, 531040 parts of low-density polyethylene, 30 parts of low-density polyethylene 221A, HD5502AA 60 parts, 20 parts of polyvinyl chloride, 30 parts of nylon, 10 parts of aluminum-based nanomaterials, 35 parts of cellulose, 2 parts of phosphite lipid stabilizer, 8 parts of acetyl tributyl citrate, 1 part of benzoyl peroxide The buffer layer is polystyrene foam; the raw materials of the outer film include by weight: 40 parts of ethylene-propylene copolymer, 40 parts of ethylene-butylene copolymer, 5 parts of copolymerized polypropylene, 20 parts of homopolypropylene, polyethylene 20 parts of octene co-elastomer, 15 parts of calcium silicate.
Embodiment 3
[0028] A plastic packaging film for laser molds, including an inner film, a buffer layer and an outer film; the raw materials of the inner film include by weight: 120 parts of polyethylene resin, 531030 parts of low-density polyethylene, 50 parts of low-density polyethylene 221A, HD5502AA 30 parts, 40 parts of polyvinyl chloride, 10 parts of nylon, 30 parts of aluminum-based nanomaterials, 15 parts of cellulose, 8 parts of phosphite lipid stabilizer, 3 parts of acetyl tributyl citrate, 6 parts of benzoyl peroxide The buffer layer is polystyrene foam; the raw materials of the outer film include by weight: 50 parts of ethylene-propylene copolymer, 20 parts of ethylene-butylene copolymer, 15 parts of copolymerized polypropylene, 10 parts of homopolypropylene, polyethylene 40 parts of octene co-elastomer, 5 parts of calcium silicate.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com